Flow Stop Bonding Wire for Encapsulation Control
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Solution Overview
Problem
Existing optoelectronic component assemblies face challenges in preventing uncontrolled flow of encapsulation material around semiconductor components, which requires complex metallizing processes and restricts conductor track layouts when using planar conductor tracks as flow stops.
Innovation Solution
A flow stop bonding wire is positioned between the semiconductor component and the encapsulation material, acting as a barrier to prevent uncontrolled flow, and can be integrated into the bonding process, eliminating the need for additional metallizing steps and providing a reliable flow stop without increasing process complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If planar conductor tracks are used as flow stops, then the need for separate flow stop components is eliminated, but the layout of conductor tracks is restricted and complicated metallizing processes are required
Solution Approach 1:
The patent combines the flow stop function with the bonding wire structure by positioning the bonding wire to protrude from the carrier element and extend into the encapsulation material. This integration eliminates the need for separate flow stop components and complex metallizing processes, while maintaining effective prevention of uncontrolled encapsulation material flow.
Solution Approach 2:
The patent extracts the flow stop function from the conductor track system and implements it through the bonding wire structure itself. By making the bonding wire protrude and extend into the encapsulation material, the flow stop capability is achieved without requiring additional metallizing steps or restricting conductor track layouts.
2Reliability
If separate flow stop components are applied around the semiconductor component, then uncontrolled flow of encapsulation material is prevented, but additional manufacturing steps and process complexity are introduced
Solution Approach 1:
The patent merges the flow stop function with the existing bonding wire structure. The bonding wire is positioned to protrude from the carrier element and extend into the encapsulation material, thereby providing flow stop capability without requiring separate flow stop components or additional manufacturing steps.
Solution Approach 2:
The bonding wire serves multiple functions: it provides electrical connection between the semiconductor component and carrier element, and simultaneously acts as a flow stop by protruding into the encapsulation material. This multi-functionality eliminates the need for separate flow stop components and reduces overall process complexity.
Data Source
AI summary
A component assembly including a carrier element including a first contact face and a semiconductor component disposed on the carrier element, wherein the semiconductor component includes a second contact face. The component assembly further includes a contact-making bonding wire, wherein one end of the contact-making bonding wire is connected to the first contact face and a second end of the contact-making bonding wire is connected to the second contact face. The component assembly includes a flow stop bonding wire positioned on the second contact face, wherein the flow stop bonding wire defines on the second contact face a first zone and a second zone. An encapsulation material is applied from the first zone to the first contact face so as to define an encapsulation for the flow stop bonding wire, wherein the flow stop bonding wire prevents an uncontrolled flow of the encapsulation material into the second zone.