Flow Substrate Sealing Layout for High-Temperature Fluid Delivery
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing fluid delivery systems struggle to handle extreme flow rates and high temperatures in semiconductor processing and petrochemical applications, with limitations in conduit design and sealing methods leading to inefficiencies and maintenance challenges.
Innovation Solution
The development of a flow substrate with adjustable conduit sizes and sealing mechanisms, including integrated or individual caps, to accommodate asymmetric port placements and provide secure, leak-proof connections for fluid handling components, suitable for extreme flow rates and temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional fluid delivery systems are used, then standard fluid handling is achieved, but they cannot handle extreme flow rates and high temperatures
Solution Approach 1:
The patent changes the physical parameters of the fluid delivery system by using a solid block substrate with internally formed conduits of varying cross-sectional areas, allowing the system to handle extreme flow rates and temperatures that conventional systems cannot accommodate
Solution Approach 2:
The invention uses composite construction with a solid block substrate material that can withstand extreme temperatures and pressures, combined with separately attachable fluid handling components, creating a system that maintains reliability under extreme conditions
2Ease of manufacture
If standardized interface designs are used, then modular assembly is simplified, but conduit size adjustment for different flow rates is limited
Solution Approach 1:
The patent applies local quality by forming conduits with different cross-sectional areas at different locations within the solid block substrate, allowing each conduit to be optimized for specific flow rate requirements while maintaining the overall modular structure
Solution Approach 2:
The invention enables dynamic adaptability by allowing the modular fluid handling components to be attached and detached from the substrate, with the substrate itself providing variable conduit sizes that can be selected based on flow rate requirements
3Ease of operation
If deformable gasket sealing is used, then component attachment is simplified, but sealing reliability at high temperatures is compromised
Solution Approach 1:
The patent employs disposable or replaceable sealing elements such as O-rings or gaskets that can be easily installed and replaced, providing simple attachment while maintaining sealing reliability through periodic replacement rather than permanent high-temperature seals
4Reliability
If metallic seals are used, then sealing durability is improved, but ionic contamination of fluid occurs
Solution Approach 1:
The invention applies different material qualities in different locations - using non-metallic sealing materials (such as elastomers or polymers) at the sealing interfaces to prevent ionic contamination, while using metallic structural components for durability and strength in non-contact areas
Data Source
Figure 1A~1B
Figure 1C~1F
Figure 1G~1I
AI summary
A flow substrate comprising a substrate body formed from a solid block of a first material, the substrate body having a first surface and a second surface opposing the first surface, a plurality of pairs of component conduit ports defined in the first surface of the substrate body, a plurality of fluid pathways extending between each respective pair of component conduit ports and in fluid communication with each component conduit port of the respective pair of component conduit ports, each respective fluid pathway being formed in the second surface of the substrate body; and at least one cap formed from a second material, the at least one cap having a first cap surface that is constructed to seal at least one fluid pathway, and a second cap surface opposing the first surface, wherein the substrate body includes an opening configured to couple with the at least one cap.