Flow Switch Gas Control for Semiconductor Processing

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Solution Overview

Problem

Current semiconductor processing systems face high operating costs due to excessive inert gas consumption, as existing methods often require larger inert gas flow rates to ensure safety, leading to inefficient use and larger ventilation and abatement systems.

Innovation Solution

A gas system with a flow switch and shutoff valve configuration that adjusts process gas flow based on actual flow rates, allowing for reduced inert gas consumption by ceasing flow when below a predetermined trigger, thereby optimizing gas usage and system size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the inert gas flow rate is sized for the largest possible flow rate of process gas to ensure safety, then the safety and hazard reduction are improved, but the inert gas consumption increases and operating costs rise

Engineering Contradiction:
ImprovesafetyVSAvoidinert gas consumption
Core Design Contradiction:
ReliabilityVSLoss of substance

Solution Approach 1:

The patent applies dynamics by making the inert gas flow rate adjustable rather than fixed. The system dynamically adapts the inert gas flow rate based on actual process gas flow conditions, transitioning from a static safety margin approach to a dynamic response system that maintains safety while optimizing gas consumption.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent implements feedback through flow switches that monitor process gas flow rates and provide signals to adjust inert gas flow accordingly. This closed-loop feedback mechanism ensures that inert gas flow is automatically reduced when process gas flow is low, while maintaining sufficient flow for safety when process gas flow is high.

Inventive Principle:
Principle #23Feedback

2Reliability

If the inert gas flow rate is sized for the largest possible flow rate of process gas to ensure safety, then the safety is improved, but the ventilation and exhaust abatement systems must be larger than necessary

Engineering Contradiction:
ImprovesafetyVSAvoidventilation system size
Core Design Contradiction:
ReliabilityVSVolume of stationary object

Solution Approach 1:

The system dynamically adjusts inert gas flow rates to match actual process conditions, allowing ventilation systems to be sized for typical rather than maximum conditions. This dynamic adaptation eliminates the need for oversized ventilation infrastructure while maintaining safety through real-time flow adjustment.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

Feedback from flow switches enables the system to respond to actual process gas flow conditions, allowing ventilation systems to operate at appropriately sized capacities rather than being constrained by worst-case scenarios. This feedback mechanism ensures safety is maintained while enabling more compact ventilation design.

Inventive Principle:
Principle #23Feedback

3Loss of substance

If a flow restrictor or flow rate governor is employed to limit process gas flows, then the inert gas requirements are reduced, but the flow rate of inert gas provided is still higher than required by the process tool

Engineering Contradiction:
Improveinert gas requirementsVSAvoidprocess gas flow rate
Core Design Contradiction:
Loss of substanceVSProductivity

Solution Approach 1:

The patent uses feedback from flow switches to automatically adjust inert gas flow rates based on actual process gas flow conditions. This eliminates the need for flow restrictors that limit productivity, as the system responds dynamically to actual flow conditions rather than imposing artificial limits, thereby maintaining both productivity and optimizing inert gas consumption.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The system changes the flow rate parameter of inert gas dynamically based on process conditions, rather than using a fixed flow restrictor. This allows the system to maintain optimal inert gas consumption while avoiding the productivity limitations imposed by flow restrictors, as the flow rate is adjusted based on actual process needs.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20220380900A1Systems and methods of controlling gas flows in semiconductor processing systems
Publication Date: 2022.12.01 ASM IP HLDG BV
  • US20220380900A1 patent drawing
  • US20220380900A1 patent drawing
  • US20220380900A1 patent drawing

AI summary

A gas system includes an enclosure, a process gas metering valve, a shutoff valve, and a flow switch. The process gas metering valve arranged within the enclosure to flow a process gas to a process chamber of a semiconductor processing system. The shutoff valve is connected to the process gas metering valve to fluidly separate the process gas metering valve from a process gas source. The flow switch is operably connected to the shutoff valve to cease flow of the process gas to the process chamber of the semiconductor processing system using the shutoff valve according to flow of a gas traversing the flow switch. Semiconductor processing systems, gas control methods, and gas system kits are also described.