Flow-Through Cooling Frame for Conduction-Cooled Circuit Boards
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for deploying conduction-cooled card assemblies in air-cooled chassis environments are limited, as they often require costly and potentially damaging modifications to the mezzanine connectors, and do not provide sufficient airflow for effective heat dissipation.
Innovation Solution
An adaptor frame with passageways for fluid flow is mounted on conduction-cooled card assemblies, allowing heat to be dissipated via air or fluid flowing through the frame, and an insert is used to increase the height of mezzanine connectors to enhance airflow between cards, without the need for costly connector replacements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conduction-cooled card assemblies are deployed in air-cooled chassis using conventional methods, then thermal management is achieved through conduction cooling frames, but costly and potentially damaging modifications to mezzanine connectors are required
Solution Approach 1:
The invention separates the cooling function from the connector structure by introducing a distinct adaptor frame component. The adaptor frame includes separate thermal management interfaces that interface with the conduction-cooled card assembly, while the mezzanine connectors remain unchanged. This segmentation allows the cooling system to be modified without affecting the connectors, eliminating modification costs and damage risks.
Solution Approach 2:
The adaptor frame serves as an intermediary component between the conduction-cooled card assembly and the air-cooled chassis environment. It provides thermal management interfaces that conduct heat from the cards and transfer it to the air cooling system, acting as a mediator that enables compatibility between conduction-cooled cards and air-cooled chassis without modifying the original card or connector designs.
2Strength
If conventional conduction cooling frames are used in air-cooled chassis, then heat conduction is maintained, but sufficient airflow for effective heat dissipation is not provided
Solution Approach 1:
The invention merges conduction cooling and air cooling systems by combining thermal management interfaces for heat conduction with air flow passageways in a single adaptor frame structure. The frame simultaneously conducts heat from the card assembly and provides pathways for air to flow across heat dissipation surfaces, integrating both cooling mechanisms into one unified system that achieves effective heat removal.
Solution Approach 2:
The adaptor frame extends the cooling system into a new dimension by adding air flow passageways that traverse the frame structure. This creates three-dimensional heat dissipation pathways that complement the traditional planar conduction cooling interfaces, enabling air to access multiple surfaces and significantly enhance overall heat dissipation capacity.
3Ease of operation
If mezzanine connectors are replaced with taller connectors to create airflow gaps, then air flow between cards is enabled, but costly connector replacements are required
Solution Approach 1:
The invention extracts the airflow gap creation function from the mezzanine connectors themselves and relocates it to the adaptor frame. Instead of modifying or replacing the connectors to create spacing, the adaptor frame is positioned between the cards to provide the necessary air gaps and flow pathways, preserving the original connectors while achieving the desired airflow.
4Reliability
If conduction-cooled card assemblies are installed in fluid-flow-through cooled chassis, then thermal management interfaces are required, but wedgelock fasteners occupy the interface space
Solution Approach 1:
The adaptor frame serves as an intermediary that provides dedicated thermal management interfaces between the conduction-cooled card assembly and the fluid-flow-through cooled chassis. These interfaces are distinct from and do not interfere with the wedgelock fastener mounting interfaces, allowing both functions to coexist without conflict or additional complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient heat dissipation and airflow between cards, reducing the risk of damage and cost associated with modifying mezzanine connectors, while providing a secure and effective thermal management system for conduction-cooled card assemblies in fluid-flow-through cooled chassis environments.
Implementation Method 1
heat from thermal management interface to be dissipated via fluid flowing through the passageway
Implementation Method 2
heat dissipation via air or fluid flowing through the frame
Data Source
Figure 1
Figure 2~3
Figure 4A~4D
AI summary
A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.