Flow-Uniformization Plate Agitation for Electroplating Bubble Control
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Solution Overview
Problem
In semiconductor electroplating, fluctuations in the electroplating solution lead to bubble formation on wafer surfaces, compromising the quality of the metal coating.
Innovation Solution
A uniform flow control agitation device with horizontally arranged flow-uniformization plates and a driving unit that rotates these plates within the electroplating tank, along with a driven assembly and specific gear mechanisms, effectively eliminates solution fluctuations and promotes ion movement, preventing bubble formation and enhancing coating uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the electroplating solution is input into the electroplating tank, then the electroplating process can proceed, but fluctuations are created that form bubbles on the wafer surface
Solution Approach 1:
The flow-uniformization plate is rotated at a predetermined speed before wafer immersion to pre-stabilize the electroplating solution surface, eliminating fluctuations that would cause bubble formation during the electroplating process
Solution Approach 2:
The flow-uniformization plate acts as an intermediary device between the solution input system and the wafer surface, using its rotation to mediate and smooth out solution flow fluctuations before they reach the wafer
2Object-affected harmful factors
If a flow-uniformization plate is added to eliminate fluctuations, then bubble formation is prevented, but device complexity increases
Solution Approach 1:
The invention extracts the flow-uniformization function from the main electroplating tank structure, using a separate, independently rotatable plate that can be removed and cleaned without disassembling the entire electroplating system
Solution Approach 2:
The flow-uniformization plate transitions from a static tank structure to a dynamic, rotatable component that actively controls solution flow patterns, allowing fluctuation elimination without increasing overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device ensures high-quality electroplating by stabilizing the electroplating solution, reducing bubble formation, and improving the uniformity of the electrodeposit coating on the wafer surface.
Implementation Method 1
a driving unit configured to rotate the flow-uniformization plate in the electroplating tank. The rotation of the flow-uniformization plate can effectively eliminate the fluctuation of the electroplating solution during electroplating
Implementation Method 2
the rotation of the flow-uniformization plate can also promote ion movement in the electroplating solution and increase the uniformity of the electrodeposit coating on the wafer's surface
Data Source
AI summary
The present invention provides a uniform flow control agitation device for electroplating, which involves the rotation of one or two flow-uniformization plates within an electroplating tank. This design effectively eliminates fluctuations in the electroplating solution during the electroplating process, thereby preventing bubbles from forming on the surface of the wafer. Simultaneously, the rotation of the flow-uniformization plates promotes the movement of ions in the electroplating solution, resulting in greater uniformity in the electrodeposit coating on the wafer's surface.