Flowable Carbon Layer Gap Filling for Smooth Multi-Trench Surfaces
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional deposition techniques for filling gaps in semiconductor devices with carbon material, such as spin on carbon (SOC), result in undesired roughness and increased costs due to additional processing equipment and steps, especially in multiple-trench structures, leading to variations in critical dimensions and line edge roughness.
Innovation Solution
A method involving the formation of two carbon layers with different initial flowabilities, where the second layer has greater flowability than the first, treated with distinct plasma processes to achieve a smooth surface without voids, using carbon precursors and plasma treatments to control thickness and flowability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional deposition techniques are used to fill gaps with carbon material, then the filling capability is achieved, but the surface roughness increases and manufacturing precision deteriorates
Solution Approach 1:
The patent divides the single carbon layer deposition process into multiple sequential deposition steps, creating distinct carbon layers with different properties. The first carbon layer has lower flowability and the second carbon layer has higher flowability, allowing each layer to serve a specific function in achieving both gap filling and surface planarization
Solution Approach 2:
The patent applies different flowability characteristics to different carbon layers deposited in sequence. The first carbon layer is designed with lower flowability to provide structural support, while the second carbon layer has higher flowability to flow into and fill the gaps, thereby achieving smooth surface formation through localized property differentiation
2Manufacturing precision
If spin on carbon (SOC) process is used to fill gaps, then the filling capability is improved, but the device complexity and processing cost increase due to additional equipment and steps
Solution Approach 1:
The patent utilizes the inherent flowability differences between sequentially deposited carbon layers to achieve self-planarization during the deposition process itself. The second carbon layer with higher flowability automatically flows into the gaps formed by the first layer, eliminating the need for separate planarization equipment or additional processing steps
Solution Approach 2:
The patent changes the deposition parameters between sequential steps to create carbon layers with different flowability characteristics. By controlling deposition conditions such as temperature, pressure, and precursor flow rates, the process generates layers with tailored properties that enable gap filling without requiring external intervention or additional equipment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides a relatively flat and smooth surface in multiple-trench structures, reducing critical dimension variation and line edge roughness, while eliminating the need for additional processing steps and equipment.
Implementation Method 1
treated with distinct plasma processes to achieve a smooth surface without voids, using carbon precursors and plasma treatments to control thickness and flowability
Implementation Method 2
forming one or more first carbon layers overlying a surface of the substrate... forming a second carbon layer with a second initial flowability overlying the first carbon layer
Data Source
AI summary
Methods and systems for forming a structure including multiple carbon layers and structures formed using the methods or systems are disclosed. Exemplary methods include forming a first carbon layer with an initial first flowability and a second carbon layer with an initial second flowability, wherein first flowability is less than second flowability.