Thermally Conductive Flowable Material for Downhole Tool Heat Dissipation

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Solution Overview

Problem

Heat-sensitive components in downhole tools face thermal loading issues due to self-heating, which can exceed their maximum operating temperatures, leading to performance degradation and reliability concerns.

Innovation Solution

A thermally conductive flowable material, such as helium or high-boiling-point esters, is used within a housing to reduce thermal resistance and dissipate heat away from components, combined with a fluid mover for enhanced convection cooling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If electronic components are used in downhole tools, then operational efficiency and information quality are improved, but thermal loading increases causing performance degradation

Engineering Contradiction:

Improveoperational efficiencyVSAvoidthermal loading

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

A thermally conductive flowable material is introduced as an intermediary substance between the electronic components and the housing. This material fills the space around the components, providing continuous thermal pathways that conduct heat away from the components to the housing, thereby reducing self-heating while allowing the components to operate efficiently

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs a flowable material that can be pumped or circulated through the housing. This fluid-based thermal management system uses convection currents to transport heat from the electronic components throughout the housing, providing active cooling that maintains operational efficiency while controlling temperature rise

Inventive Principle:

Principle #29Pneumatics and hydraulics

2Temperature

If conventional cooling methods are used, then thermal loading is reduced, but device complexity increases

Engineering Contradiction:

Improvethermal loadingVSAvoidcooling system complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The flowable material is designed to be self-circulating through natural convection currents. As the material heats up near the electronic components, it naturally rises and circulates throughout the housing, carrying heat away. This passive cooling mechanism eliminates the need for active pumps or complex thermal management systems, reducing device complexity while maintaining effective heat dissipation

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively reduces the thermal loading on components, maintaining them within safe temperature ranges and extending their operational reliability by efficiently dissipating heat through both conduction and convection.

Implementation Method 1

a thermally conductive flowable material in thermal communication with the component(s)

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

combined with a fluid mover for enhanced convection cooling

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS8826984B2Method and apparatus of heat dissipaters for electronic components in downhole tools

Publication Date: 2014.09.09 BAKER HUGHES CO

AI summary

Devices and related methods for reducing a thermal loading of one or more components may include a housing having an interior for receiving the component(s), and a thermally conductive flowable material in thermal communication to the component(s).