Flowable Thermally Conductive Composition for Electronic Heat Sink Assembly
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Solution Overview
Problem
Conventional electrical insulation materials have low thermal conductivity, limiting heat dissipation in electronic devices and hindering the development of higher power density devices, especially in applications like automotive lithium battery assemblies and electronic components operating at higher frequencies.
Innovation Solution
A flowable hardenable composition comprising shaped composite particles with thermally conductive particles retained in a binder matrix, which can provide thermal cooling at lower levels of thermal filler particles, especially when flakes, platelet-like, or acicular particles are used, allowing for improved thermal management in electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electrical insulation materials are used, then electrical insulation is provided, but thermal conductivity is low which limits heat dissipation
Solution Approach 1:
The patent applies composite materials by combining thermally conductive particles (such as aluminum oxide, boron nitride, or diamond) with an electrically insulating binder matrix. This creates a composite material that simultaneously provides electrical insulation from the binder and thermal conductivity from the dispersed particles, resolving the contradiction between electrical insulation and heat dissipation capabilities
Solution Approach 2:
The patent applies local quality by creating regions with different properties within the composition. The thermally conductive particles are distributed throughout the insulating binder matrix, creating local thermal conduction pathways while maintaining overall electrical insulation. This allows different parts of the material to serve different functions - the binder provides insulation while the particles provide thermal conduction
2Temperature
If thermal filler particles are added to improve thermal conductivity, then heat dissipation improves, but the composition becomes less flowable and harder to process
Solution Approach 1:
The patent applies parameter changes by carefully controlling the size, shape, and distribution parameters of the thermally conductive particles. By optimizing particle size (typically 1-100 micrometers) and aspect ratio, and by adjusting the binder matrix composition and viscosity, the material achieves adequate flowability for processing while maintaining high thermal conductivity. The hardenable nature of the binder also allows the composition to be flowable during application but rigid after curing
3Temperature
If high levels of thermal filler particles are used to maximize thermal conductivity, then heat dissipation improves, but the mechanical strength and durability of the composition decrease
Solution Approach 1:
The patent applies composite materials by creating a balanced formulation where the binder matrix provides mechanical strength and structural integrity while the thermally conductive particles provide heat dissipation. The binder acts as a continuous phase that binds the particles together, ensuring the composition maintains adequate mechanical strength even with significant particle loading (typically 40-80 weight percent)
Solution Approach 2:
The patent applies local quality by ensuring the binder matrix forms a continuous phase throughout the composition, creating local regions of mechanical strength that hold the thermally conductive particles together. This continuous binder network maintains overall structural integrity while allowing discrete particle regions to provide thermal conduction pathways
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances thermal conductivity and durability, enabling more efficient heat dissipation and longer device reliability in high-frequency electronic components and automotive applications.
Implementation Method 1
shaped composite particles comprising thermal filler particles having an aspect ratio of at least 1.5 retained in a binder matrix
Implementation Method 2
a flowable hardenable composition comprising from 10 to 95 percent by volume of shaped composite particles dispersed in a hardenable binder precursor
Data Source
AI summary
A flowable hardenable composition comprising from 10 to 95 percent by volume of shaped composite particles dispersed in a hardenable binder precursor. The shaped composite particles comprise thermal filler particles having an aspect ratio of at least 1.5 retained in a binder matrix. After hardening, a thermally conductive composition is obtained. An electronic heat sink assembly comprises an electronic component, a heat sink, and the thermally conductive composition sandwiched therebetween.