Sealing Structure for Flowmeter Heat Radiation and Leakage Control
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Solution Overview
Problem
Conventional sealing structures in flowmeters face issues with heat radiation causing disorder in control circuits and inadequate sealing performance due to thermal shrinkage and gaps between resinous and radiation members, leading to leakage and uncontrolled fluid flow.
Innovation Solution
A sealing structure incorporating a resinous casing, an embedded radiation member with a heat receiving portion, and a sealing member, where the radiation member is partially embedded in the resinous member, and the substrate covers the heat receiving portion with the resinous member, creating sealed contact boundaries to enhance sealing performance and prevent fluid intrusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the radiation member is insert-molded in the resinous member, then heat radiation from the control circuit is improved, but gaps and thermal shrinkage occur at the boundary causing sealing material leakage
Solution Approach 1:
The substrate acts as an intermediary component between the radiation member and the sealing member. It fills the gaps and thermal shrinkage defects at the boundary, providing a reliable sealing surface that prevents sealing material leakage while maintaining heat radiation functionality
Solution Approach 2:
The substrate's thermal expansion coefficient is specifically selected to match or complement the radiation member and resinous member. This parameter matching minimizes thermal shrinkage gaps during molding while allowing the substrate to provide adequate sealing contact area
2Length of stationary object
If the boundary area between resinous member and radiation member is increased, then the leakage path is lengthened, but sealing material still flows into the boundary through the periphery
Solution Approach 1:
The sealing function is segmented into multiple components: the substrate provides the primary sealing barrier at the boundary, while the sealing member provides secondary sealing. This segmentation allows the substrate to handle the critical sealing task at the radiation member boundary, preventing sealing material infiltration regardless of boundary area size
Solution Approach 2:
The substrate serves as an intermediary sealing layer between the radiation member and the sealing member. It creates a reliable barrier that prevents sealing material from reaching the boundary periphery, making the boundary area size irrelevant for sealing effectiveness
3Reliability
If the substrate covers the heat receiving portion with the resinous member, then sealing performance is enhanced, but heat dissipation path may be blocked
Solution Approach 1:
The substrate is segmented into a first surface portion that contacts the heat receiving portion and a second surface portion that contacts the resinous member. This segmentation allows the substrate to provide sealing at the boundary while maintaining thermal conduction path from the heat receiving portion through the first surface portion
Solution Approach 2:
The substrate has different functional zones: the first surface portion is optimized for thermal contact with the heat receiving portion, while the second surface portion provides sealing contact with the resinous member. This local differentiation allows simultaneous achievement of heat dissipation and sealing functions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed sealing structure effectively restricts leakage and fluid intrusion while allowing heat dissipation from the control circuit, enhancing the sealing performance and protecting the circuit from thermal disorders.
Implementation Method 1
the radiation member radiates heat emitted from the electric circuit to an outside of the casing portion
Implementation Method 2
the radiation member radiates heat emitted from the electric circuit to an outside of the casing portion
Implementation Method 3
The heat receiving portion receives the heat of the electric circuit
Data Source
AI summary
A substrate includes a first surface portion, which covers a heat receiving portion of a radiation member together with a resinous member. The substrate further includes a second surface portion, which is on the outer periphery of the first surface portion. The substrate makes contact with the resinous member via the second surface portion. The first surface portion and the heat receiving portion have a first contact boundary therebetween. The second surface portion and the resinous member have a second contact boundary that surrounds the first contact boundary. The second contact boundary is sealed using a sealing member. The sealing member is restricted from flowing into a boundary between the first contact boundary and the second contact boundary.