Fluid Application Thickness Control via Local Heating
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In industrial processes like semiconductor wafer thinning, the uneven application of viscous fluids such as glue contributes to significant total thickness variation, which is difficult to control due to their non-Newtonian properties at ambient temperatures.
Innovation Solution
A method and apparatus that locally heats the fluid on a substrate to adjust its viscosity, using infrared or resistive heating mechanisms, allowing for a controlled thickness profile by rotating the substrate and measuring the fluid thickness to achieve uniform distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If viscous fluid is applied to substrate without temperature control, then application process is simple, but thickness uniformity deteriorates due to temperature-dependent viscosity
Solution Approach 1:
The patent applies temperature control to change the viscosity parameter of the fluid. By heating the substrate or fluid to a controlled temperature range, the viscosity becomes more stable and predictable, allowing for uniform thickness distribution during fluid application. This resolves the contradiction by modifying the physical parameter (temperature) to achieve both manageable application process and precise thickness control.
Solution Approach 2:
The patent implements preliminary heating of the substrate or fluid before fluid application. This preliminary action ensures that the fluid reaches the optimal temperature and viscosity state before the actual coating process, preventing thickness variations during application. This advance preparation resolves the contradiction by ensuring consistent fluid properties before the critical application step.
2Stability of the object's composition
If fluid viscosity is high at ambient temperature, then fluid remains stable, but dispersion uniformity deteriorates on substrate
Solution Approach 1:
The patent changes the temperature parameter during the dispersion phase. By locally heating areas with excessive fluid accumulation, the viscosity decreases temporarily, allowing the fluid to redistribute more uniformly across the substrate. This resolves the contradiction by dynamically adjusting the temperature parameter to achieve uniform dispersion while maintaining overall fluid stability.
Solution Approach 2:
The patent introduces dynamic temperature adjustment during the dispersion process. Instead of maintaining a static temperature, the system actively heats or cools specific regions based on real-time thickness measurements, creating a dynamic viscosity profile that promotes uniform dispersion. This dynamic approach resolves the contradiction between stability and uniformity.
3Manufacturing precision
If local heating is applied to adjust viscosity, then thickness uniformity improves, but process complexity increases
Solution Approach 1:
The patent replaces complex mechanical viscosity control systems with a thermal field approach. Instead of using mechanical devices to directly control fluid viscosity, the system uses infrared heating elements and temperature sensors to indirectly control viscosity through temperature management. This substitution reduces mechanical complexity while achieving the same thickness uniformity goal.
Solution Approach 2:
The patent introduces temperature as an intermediary parameter between the heating system and fluid viscosity. Rather than directly controlling viscosity, the system controls temperature, which then naturally adjusts viscosity through the fluid's temperature-viscosity relationship. This intermediary approach simplifies the control system while maintaining precise thickness control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces thickness variation of the fluid to within desired limits, improving the uniformity of the application and contributing to reduced total thickness variation of the substrate, facilitating precise thinning and etching processes.
Implementation Method 1
A method and apparatus that locally heats the substrate or fluid to adjust viscosity, using infrared or resistive heating mechanisms
Implementation Method 2
A method and apparatus that locally heats the substrate or fluid to adjust viscosity, using infrared or resistive heating mechanisms
Implementation Method 3
locally heats the substrate or fluid to adjust viscosity... enabling a more uniform thickness profile by mimicking Newtonian fluid behavior
Data Source
AI summary
Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.