Fluid Application Station for Component Placement Throughput
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Solution Overview
Problem
In component placement machines, the need to move the entire housing and rotatable frame to a fluid application station for applying fluids to components reduces machine throughput, as other pick and place heads are prevented from operating during this motion.
Innovation Solution
An on-the-housing fluid application station is integrated with the component placement machine, allowing fluid application to components after they are picked up but before placement on the PCB, eliminating the need for the rotatable frame to move to a separate fluid application station.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the entire housing and rotatable frame are moved to a fluid application station to apply fluid to a component, then the fluid can be applied to the component, but the machine throughput is reduced because all other pick and place heads are prevented from operating during this motion
Solution Approach 1:
The patent divides the fluid application function from the main housing and rotatable frame, creating a separate, movable fluid application device that can operate independently. This segmentation allows the fluid application to occur without requiring the entire placement machine to stop and move to a dedicated station, thus maintaining throughput while ensuring reliable fluid application.
Solution Approach 2:
The patent introduces an intermediary movable fluid application device that acts as a mediator between the component and the fluid source. This device can quickly position itself near the component at the pick station and apply fluid without requiring the main housing to move, serving as a buffer that decouples the fluid application operation from the overall machine cycle.
2Reliability
If the rotatable frame is moved to a fluid application station to apply fluid to a component, then the fluid application can be completed, but the operation of other pick and place heads is disrupted
Solution Approach 1:
The patent employs a dynamic, movable fluid application device that can quickly position itself as needed rather than requiring the static housing to move to a fixed fluid station. This dynamic approach allows fluid application to occur at the pick station without disrupting the continuous operation of other heads, maintaining ease of operation while ensuring reliable fluid application.
Solution Approach 2:
The movable fluid application device is positioned and ready to apply fluid preliminarily at the pick station before the component is placed on the PCB. This preliminary action at the pick location eliminates the need to interrupt other operations by moving to a separate fluid station, allowing continuous operation while completing fluid application.
3Reliability
If the housing moves to a designated fluid application station, then fluid can be applied to the component, but the placement machine throughput is reduced due to this motion
Solution Approach 1:
The patent changes the spatial arrangement by moving the fluid application capability from a fixed station in the X-Y plane to a movable device that operates in the Z-dimension (vertical movement) and can position itself near the pick station. This dimensional change eliminates the need for the housing to travel horizontally to a fluid station, reducing cycle time while maintaining reliable fluid application.
Solution Approach 2:
The patent extracts the fluid application function from the main housing structure and places it in a separate, movable device. This extraction allows the fluid application to occur independently without requiring the housing to move to a designated station, thereby eliminating the time loss associated with housing movement while ensuring reliable fluid application through the dedicated fluid application device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration enables fluid application within the placement cycle without disrupting the operation of other pick and place heads, thereby maintaining or improving the machine's throughput compared to traditional systems.
Implementation Method 1
Each vacuum spindle may be moved in the Z-axis (i.e., in and out from an extended to a retracted position). Each nozzle is sized and otherwise configured for use with each different size and style of component to be placed by the machine. The nozzle is lowered, via its associated vacuum spindle (i.e., extended) to a point where, upon application of vacuum, the component is removed from the feeder, and held tightly against the vacuum nozzle orifice.
Data Source
AI summary
Disclosed herein is a method for applying a fluid to a component during a placement cycle. The method includes providing a component placement machine including a housing having a frame attached thereto, the frame having a pick and place head. The method includes providing a fluid application station contiguous with the housing and adapted to apply fluid to the component, moving the housing to a pick location, picking the component from a supply of components using the pick and place head, moving the housing to a location, applying fluid to the picked component, and placing the picked component with the fluid applied onto the printed circuit board at the location. The fluid application step is accomplished during the moving step or placing step. The method may further include repeating the steps for another component where the fluid application step is accomplished during the repeated picking step of the additional component.