Fluid-Assisted Thermoelectric PCB Thermal Management
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Solution Overview
Problem
Traditional cooling methods, such as fans and heat sinks, are ineffective for integrated circuits in areas with limited airflow, necessitating an alternative thermal management solution for automotive electronics.
Innovation Solution
A fluid-assisted thermoelectric cooling system that converts thermal energy into electrical energy using the Seebeck effect, employing a sealed fluid circuit with thermal transfer fluid and Seebeck effect thermoelectric junctions to facilitate thermal energy transfer via electrical conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional cooling methods (fan and heat sink) are used, then cooling effectiveness is achieved in areas with substantial airflow, but cooling is ineffective in areas with limited airflow
Solution Approach 1:
The patent replaces the mechanical convection-based cooling system (fan and heat sink) with a thermoelectric cooling system that uses electrical conduction and phase change of thermal transfer fluid. This substitution enables effective cooling in areas with limited airflow by eliminating dependence on air convection.
Solution Approach 2:
The patent introduces a liquid-based thermal transfer fluid system to replace air-based convection cooling. The fluid circulates through channels adjacent to the electronic component, absorbing heat through conduction and convection within the liquid phase, then transports it to a radiator for dissipation, enabling effective cooling independent of ambient airflow conditions.
2Temperature
If liquid cooling with pumps and radiators is used, then thermal energy can be transported from high temperature area, but system complexity increases
Solution Approach 1:
The patent employs a thermoelectric cooler that simultaneously performs two functions: cooling the electronic component and generating electrical energy from the temperature difference. This self-service approach eliminates the need for separate cooling systems and reduces overall system complexity while maintaining effective thermal management.
Solution Approach 2:
The thermoelectric cooling system serves multiple purposes: it cools the electronic component, transports thermal energy to the radiator, and generates electrical energy through the Seebeck effect. This multi-functionality reduces the need for additional components and simplifies the overall system architecture compared to traditional liquid cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively cools integrated circuits by circulating thermal transfer fluid and converting heat into electrical energy, maintaining the component at a stable temperature despite limited airflow conditions.
Implementation Method 1
At least one Seebeck effect thermoelectric junction converts heat into electrical energy
Implementation Method 2
Heat from the electronic component is transferred to the thermal transfer fluid
Implementation Method 3
The thermal transfer fluid is circulated within the sealed fluid circuit
Implementation Method 4
The invention may exploit the latent heat of evaporation of thermal transfer fluid
Data Source
AI summary
A cooling system for electronics includes an electronic component to be cooled, a first chamber containing the electronic component, means for converting heat into electrical energy, a second chamber containing the converting means, a first conduit fluidly interconnecting the first chamber and the second chamber, a second conduit fluidly interconnecting the first chamber and the second chamber such that the first chamber, the second chamber, the first conduit and the second conduit form a fluid circuit. Thermal transfer fluid is disposed in the fluid circuit, wherein the fluid circuit circulates the thermal transfer fluid therein.