Mobile Fluid Bonding for Distortion-Free Substrate Alignment
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Solution Overview
Problem
Existing methods for bonding substrates in the semiconductor industry face challenges with alignment accuracy due to substrate distortions during the bonding process, leading to overlay errors, which are not adequately addressed by current technologies.
Innovation Solution
A device and method utilizing a mobile deformation device that deforms substrates using a fluid, such as a hollow pin or nozzle, to apply controlled pretension radially, ensuring distortion-free and expansion-free bonding by reducing point-like deformations and transferring forces perpendicular to the substrate surface, thereby improving alignment accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If a mechanical pin is used for central contacting, then bonding force is applied, but forces parallel to the substrate surface are generated causing distortion
Solution Approach 1:
The patent replaces mechanical pin contact with a pneumatic deformation device that uses pressurized gas delivered through a nozzle to deform the substrate. This pneumatic approach applies force perpendicular to the substrate surface without mechanical contact, eliminating parallel forces that cause distortion while maintaining effective bonding pressure.
Solution Approach 2:
The invention substitutes the mechanical pin-based deformation device with a pneumatic system consisting of a nozzle and pressurized gas supply. This replacement eliminates direct mechanical contact and associated friction/parallel forces, achieving substrate deformation through gas pressure alone, thereby preventing distortion.
2Shape
If a fixed nozzle is used for gas delivery, then deformation is applied, but control options are limited reducing bonding accuracy
Solution Approach 1:
The patent implements a mobile nozzle that can be moved to different positions and orientations, transforming the static gas delivery system into a dynamic one. This mobility allows the deformation device to be precisely positioned and angled to apply deformation exactly where needed on the substrate, providing full control over the deformation process and eliminating the limitations of fixed nozzles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves precise and distortion-free bonding across the entire area, reducing overlay errors by enabling controlled and gentle deformation of substrates, ensuring accurate alignment and minimizing local deformations through homogeneous force distribution and adjustable fluid parameters.
Implementation Method 1
at least one deformation device for deforming at least one of the two substrates by means of a fluid
Implementation Method 2
deforms at least one of the two substrates by means of a fluid, wherein the at least one deformation device is mobile
Data Source
AI summary
The present invention relates to a device for bonding a first substrate with a second substrate, comprising at least one deformation device for deforming at least one of the two substrates by means of a fluid, wherein the at least one deformation device is mobile. Moreover, the invention relates to a corresponding method.