Fluid Channel Module Vortex Protrusion PCB Cooling
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Solution Overview
Problem
Conventional power devices face challenges in effectively cooling components, especially those not in direct contact with heat dissipation members, and in minimizing blind spots where cooling fluid cannot flow, particularly in densely packed PCB configurations.
Innovation Solution
A fluid channel module is introduced, comprising a fluid channel division member, a duct member, and a vortex formation member. The fluid channel division member communicates with the housing space to introduce fluid, the duct member allows fluid flow, and the vortex formation member, with a vortex protrusion, ensures efficient fluid discharge and formation of a vortex for enhanced heat exchange.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional heat dissipation member is used, then components in direct contact can be cooled, but components not in direct contact (such as PCBs) cannot be effectively cooled
Solution Approach 1:
The patent introduces a fluid channel module as an intermediary system that circulates cooling fluid through channels formed between PCBs. This mediator enables indirect cooling of PCBs without requiring direct thermal contact with heat dissipation members, thus expanding cooling coverage to components that were previously inaccessible to conventional heat dissipation structures.
2Productivity
If the power device is advanced and integrated with multiple PCBs, then functionality is improved, but heat generation increases and cooling becomes more difficult
Solution Approach 1:
The patent segments the cooling system by forming separate fluid channels between each PCB and introducing vortex formation members at strategic locations. This segmentation allows the cooling fluid to be distributed independently to different PCBs, enabling effective heat management in highly integrated devices with multiple heat-generating components.
Solution Approach 2:
The patent utilizes the narrow spaces between stacked PCBs in the vertical dimension to form fluid channels. By exploiting this third dimension (depth/vertical space) rather than only horizontal space, the system achieves cooling coverage for densely packed components without increasing the device footprint.
3Reliability
If a plate-shaped PCB cooling device is used, then cooling can be achieved, but device miniaturization is difficult
Solution Approach 1:
The patent embeds the fluid channel structure within the existing PCB assembly architecture, nesting cooling channels between the PCB layers themselves. The vortex formation members are integrated into the channel structure rather than added as separate external components. This nesting approach enables cooling functionality without increasing the overall device volume, achieving miniaturization while maintaining cooling capability.
4Reliability
If water cooling is used instead of air cooling, then cooling efficiency is improved, but waterproofing processes and separate cooling systems are required
Solution Approach 1:
The patent employs air as the cooling fluid, which is naturally available and requires no external supply system. The air cooling system utilizes the existing internal air circulation of the device, eliminating the need for separate water cooling infrastructure such as water tanks, pumps, and waterproofing processes. This self-service approach maintains adequate cooling efficiency while significantly reducing system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The fluid channel module enables effective cooling of power device components without a separate fluid supply source, minimizes blind spots for fluid flow, and improves cooling efficiency by allowing fluid to flow smoothly through various spaces, including those between stacked PCBs.
Implementation Method 1
a vortex formation member which is coupled to the duct member and communicates with the duct member to allow the fluid to flow therethrough, wherein the vortex formation member includes a vortex protrusion formed on an inner surface of an end in an extension direction thereof and configured such that the fluid is discharged while forming a vortex
Data Source
AI summary
Disclosed are a fluid channel module and a power device including same. A fluid channel module according to an aspect of the present disclosure may include: a fluid channel division member communicating with a space of a housing to allow a fluid flowing in the space to be introduced thereinto; a duct member which is coupled to the fluid channel division member and communicates with the fluid channel division member to allow the fluid to flow therethrough; and a vortex formation member which is coupled to the duct member and communicates with the duct member to allow the fluid to flow therethrough, wherein the vortex formation member includes a vortex protrusion formed on the inner surface of the end in the extension direction thereof and configured such that the fluid is discharged while forming a vortex.