Fluid Circulation Mechanism for Rapid Substrate Cooling
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Solution Overview
Problem
Current vertical substrate processing apparatuses require extended time to cool the transfer chamber and substrates due to inefficient cooling mechanisms, which can lead to temperature biases and increased processing times.
Innovation Solution
A fluid circulation mechanism with suction parts and heat exchangers is implemented to rapidly cool the transfer chamber, combined with a cooling wall to absorb radiant heat, reducing the temperature rise and promoting heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling wall with coolant circulation is used to cool substrates in the transfer chamber, then cooling capability is improved, but device complexity increases
Solution Approach 1:
The invention extracts the cooling function from the complex cooling wall system and implements it through a simpler fluid circulation mechanism with heat exchangers positioned at strategic locations, thereby maintaining cooling capability while reducing device complexity
Solution Approach 2:
The invention introduces a fluid circulation mechanism as an intermediary between the heat source (substrates) and the cooling system, using heat exchangers to transfer heat through a fluid medium, which simplifies the overall cooling architecture compared to direct coolant circulation through cooling walls
2Temperature
If multiple cooling mechanisms (cooling wall, cooling gas supply, clean unit) are provided to cool substrates, then cooling effectiveness is improved, but device complexity increases
Solution Approach 1:
The invention merges multiple cooling functions into a single integrated fluid circulation mechanism that combines the roles of cooling wall, cooling gas supply, and clean unit into one unified system, thereby maintaining cooling effectiveness while reducing the number of separate components
Solution Approach 2:
The fluid circulation mechanism is designed to perform multiple cooling functions simultaneously - it cools substrates, maintains clean air flow in the transfer chamber, and provides thermal management, making the system universal and multi-functional while reducing component count
3Temperature
If the substrate holder is lowered to the bottom position in the preparatory chamber, then cooling efficiency is improved, but processing time increases
Solution Approach 1:
The invention performs preliminary cooling actions by positioning heat exchangers to maximize heat transfer during the substrate transfer process itself, so that cooling begins before the substrate holder reaches the bottom position, thereby improving cooling efficiency without extending processing time
Solution Approach 2:
The fluid circulation mechanism maintains continuous cooling action throughout the substrate transfer and cooling process, ensuring that heat removal is ongoing without interruption or idle periods, which improves cooling efficiency while maintaining efficient processing timing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly shortens the cooling time of the transfer chamber and substrates, maintaining a consistent temperature and preventing temperature biases, thus enhancing processing efficiency and reducing the risk of oxide film growth.
Implementation Method 1
a cooling mechanism provided in the flow path and configured to cool the fluid, and a control part configured to control the fluid circulation mechanism and the elevating mechanism so as to lower the substrate holder from the reaction furnace to the predetermined position in the preparatory chamber, circulate the fluid sucked from the suction part through the flow path, and supply the fluid from the supply part to the preparatory chamber. The cooling mechanism is disposed adjacent to the suction part to cool the fluid introduced from the suction part with the cooling mechanism before circulating the fluid through the flow path.
Implementation Method 2
combined with a cooling wall to absorb radiant heat, reducing the temperature rise and promoting heat dissipation
Data Source
AI summary
A substrate processing apparatus, includes a reaction furnace, a preparatory chamber provided below the reaction furnace, an elevating mechanism configured to raise/lower a substrate holder between the reaction furnace and the preparatory chamber, a fluid circulation mechanism including a suction part for sucking a fluid within the preparatory chamber, a pipe part constituting a flow path through which the fluid flows from the suction part to a supply part, and a cooling mechanism, provided in the flow path, for cooling the fluid, and a control part for controlling the fluid circulation mechanism and the elevating mechanism to circulate the fluid sucked from the suction part through the flow path, and supply the fluid from the supply part to the preparatory chamber. The cooling mechanism is disposed adjacent to the suction part to cool the fluid introduced from the suction part before circulating the fluid through the flow path.