Fluid Conductive Material Transfer via Thermal Phase Change
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for producing electrically conductive patterns on substrates like paper and fabric are hindered by the high cost and difficulty of handling conductive polymers, and metallic compounds require pulverization to small particle sizes, increasing costs and complexity in printing processes.
Innovation Solution
A method involving preheating the substrate and spraying electrically conductive material in fluid form, followed by controlled cooling below its melting point using a roller, ensures good adhesion and efficient pattern formation, suitable for mass production and various conductive materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive polymers are used as ink in printing presses or inkjet printers, then electrically conductive patterns can be produced, but the cost and difficulty of handling increase significantly
Solution Approach 1:
The patent changes the physical state parameter of the conductive material from solid to fluid by heating it above its melting point. This allows the material to be sprayed onto the substrate in fluid form and then solidify upon cooling, eliminating the need for complex handling of solid conductive polymers while maintaining electrical conductivity
Solution Approach 2:
The patent replaces mechanical pulverization and handling of solid conductive materials with a thermal processing system that melts and sprays the material in fluid form. This substitution of mechanical processes with thermal-fluid processes simplifies the manufacturing procedure and reduces handling difficulty
2Ease of operation
If metallic compounds are pulverized to small particle sizes for inkjet printing, then smooth flow through nozzles is achieved, but the price increases radically
Solution Approach 1:
Instead of mechanically reducing particle size to achieve smooth flow, the patent changes the temperature parameter to melt the metallic compound, creating a fluid that flows smoothly through the spraying system. This thermal approach avoids the need for expensive fine pulverization while maintaining operational ease
Solution Approach 2:
The patent utilizes the phase transition of metallic compounds from solid to liquid by heating above the melting point. This phase change enables the material to flow smoothly through the spraying apparatus without requiring mechanical size reduction, thereby avoiding the increased costs associated with fine pulverization
3Manufacturing precision
If fluid electrically conductive material is sprayed onto a cold substrate, then the material solidifies quickly, but adhesion to the substrate is poor
Solution Approach 1:
The patent applies preliminary heating to the substrate before spraying the fluid conductive material. This preheating action ensures that the substrate surface is at an appropriate temperature to receive and adhere to the sprayed material, preventing poor adhesion that would result from spraying onto a cold substrate
4Strength
If the substrate is preheated and material is sprayed in fluid form, then good adhesion is achieved, but additional heating and cooling steps are required
Solution Approach 1:
The patent combines multiple functions into integrated components: the substrate preheater also serves as the heating source for the conductive material, and the cooling system simultaneously cools both the substrate and the sprayed material. This merging of functions reduces the number of separate process steps and equipment components required
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for cost-effective and efficient transfer of electrically conductive patterns onto substrates, ensuring strong adhesion and smooth, continuous conductive layers, even on diverse surfaces, while maintaining the economic viability of printed electronics for disposable products.
Implementation Method 1
preheating a substrate to a first temperature
Implementation Method 2
cooling the substrate onto which said fluid electrically conductive material was sprayed to a third temperature, which is lower than said melting point of said electrically conductive material; wherein said cooling comprises pressing that surface of the substrate, onto which said fluid electrically conductive material was sprayed, against a roller, and actively keeping a surface temperature of said roller lower than said melting point
Implementation Method 3
heating it above its melting temperature
Data Source
AI summary
A method and an arrangement are disclosed for transferring electrically conductive material in fluid form onto a substrate. Said substrate is preheated to a first temperature, and of said electrically conductive material there is produced fluid electrically conductive material. The fluid electrically conductive material is sprayed onto the preheated substrate to form a pattern of predetermined kind. The substrate onto which said fluid electrically conductive material was sprayed is cooled to a third temperature, which is lower than the melting point of said electrically conductive material.