Fluid-Cooled Power Module With Integrated DBM Cooling Channels

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Solution Overview

Problem

Existing semiconductor device modules face inefficiencies in heat dissipation, leading to overheating issues that compromise reliability and increase operating costs, constrained power density, and limited design capabilities due to inadequate cooling methods.

Innovation Solution

Implementing a fluid-cooled direct bonded metal structure with a heat sink and non-conductive layer, utilizing cooling fluid pathways through the conductive and non-conductive layers, and incorporating fin configurations such as oblique and L-shaped fins to enhance thermal performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional cooling methods are used, then device structure is simple, but heat dissipation efficiency is insufficient leading to overheating

Engineering Contradiction:

Improveoperating temperatureVSAvoiddevice reliability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent implements a fluid-cooled direct bonded metal structure where cooling fluid flows through channels formed in the DBM layers, utilizing hydraulic principles to efficiently remove heat from semiconductor devices. The fluid circulation system enables superior heat dissipation compared to conventional air or passive cooling methods.

Inventive Principle:

Principle #29Pneumatics and hydraulics

Solution Approach 2:

The patent employs a composite structure combining conductive DBM layers with non-conductive ceramic layers (such as alumina or aluminum nitride). This composite material approach provides both thermal management capabilities and electrical insulation, resolving the contradiction between heat dissipation and device reliability.

Inventive Principle:

Principle #40Composite materials

2Reliability

If heat dissipation is improved through advanced cooling, then reliability increases, but device complexity increases

Engineering Contradiction:

Improvedevice reliabilityVSAvoidcooling structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the cooling function with the structural DBM layers by forming cooling channels directly within the conductive layers during the direct bonded metal fabrication process. This integration eliminates the need for separate cooling components, reducing overall device complexity while maintaining high reliability through effective heat dissipation.

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If cooling fluid pathways are integrated into DBM structure, then heat dissipation improves, but manufacturing complexity increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidmanufacturing ease

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent incorporates cooling channel formation as a preliminary step during the DBM layer fabrication process, before final device assembly. By pre-forming the cooling pathways in the conductive layers during manufacturing, the design achieves superior heat dissipation without adding complex post-processing steps or assembly operations.

Inventive Principle:

Principle #10Preliminary action

4Power

If power density is increased, then device performance improves, but thermal management becomes more difficult

Engineering Contradiction:

Improvepower densityVSAvoidthermal management difficulty

Core Design Contradiction:

PowerVSTemperature

Solution Approach 1:

The patent utilizes fluid circulation through integrated cooling channels to manage the thermal loads generated by high power density devices. The hydraulic cooling system efficiently removes heat from concentrated power sources, enabling increased power density without compromising thermal management or device reliability.

Inventive Principle:

Principle #29Pneumatics and hydraulics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The fluid-cooled approach significantly improves heat dissipation, reducing thermal resistance and operating temperatures, thereby enhancing reliability and design flexibility of semiconductor devices.

Implementation Method 1

a second conductive layer configured to support a flow of cooling fluid in contact with a surface area of the second conductive layer

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a heat sink coupled to the second conductive layer

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 3

configured to support a flow of cooling fluid

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS20250329610A1Fluid-cooled power module

Publication Date: 2025.10.23 SEMICON COMPONENTS IND LLC

AI summary

Fluid-cooled power modules are disclosed, in which high power semiconductor chips are mounted on direct bonded metal (DBM) structures implemented with various cooling options. Such fluid-cooled power modules are suitable for use in electric vehicles or industrial applications. A cooling unit can be attached to the DBM structure, to provide a flow of cooling fluid that can be routed through a heat sink, or through channels formed in different layers of the DBM. A fluid pipe can route coolant through an encapsulant, to surround the semiconductor chips on multiple sides. A pair of DBMs can be included to provide double-sided cooling, or to accommodate multiple arrays of chips.