Fluid-Cooled Thermal Support Structure With Graded Projection Spacing

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Solution Overview

Problem

Existing thermal support structures for electronics devices face challenges in providing effective cooling, especially when multiple devices are arranged compactly, leading to non-uniform temperatures and electrical imbalances that affect performance and reliability.

Innovation Solution

A fluid-cooled thermal support structure with an array of projections arranged non-uniformly along the coolant flow path, where the spacing between projections decreases gradually from the inlet to the outlet, enhancing heat transfer and maintaining uniform device temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If uniform spacing between projections is used, then manufacturing is simpler, but heat transfer uniformity and cooling effectiveness deteriorate

Engineering Contradiction:

Improveprojection spacing uniformityVSAvoidtemperature uniformity across electronics

Core Design Contradiction:

Manufacturing precisionVSTemperature

Solution Approach 1:

The patent applies local quality by varying the spacing between projections along the coolant flow direction. Projections near the inlet have larger spacing to reduce pressure drop, while projections near the outlet have smaller spacing to enhance heat transfer as coolant temperature increases. This non-uniform spacing optimizes heat transfer effectiveness at different locations while maintaining manufacturability through standardized projection geometries.

Inventive Principle:

Principle #3Local quality

2Temperature

If more projections are added to increase heat transfer, then cooling effectiveness improves, but pressure drop and manufacturing complexity increase

Engineering Contradiction:

Improvecooling effectivenessVSAvoidprojection array complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent changes the spacing parameter between projections along the flow direction rather than uniformly increasing the number of projections. This approach enhances heat transfer effectiveness by optimizing local spacing where it matters most (near the outlet where coolant is hottest) while avoiding excessive pressure drop near the inlet. The standardized projection geometry maintains manufacturing simplicity.

Inventive Principle:

Principle #35Parameter changes

3Volume of moving object

If compact arrangement of electronics devices is used, then space utilization improves, but heat transfer effectiveness and temperature uniformity deteriorate

Engineering Contradiction:

Improvedevice package sizeVSAvoidtemperature distribution uniformity

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The non-uniform projection spacing creates zones of different heat transfer intensity to match the thermal distribution of compactly arranged electronics. Areas with higher heat generation receive enhanced cooling through optimized projection spacing, while maintaining overall compact packaging. The gradual spacing variation accommodates multiple devices in close proximity with improved temperature uniformity.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The non-uniform projection arrangement ensures efficient heat transfer and uniform temperature distribution across electronics devices, improving reliability and efficiency while reducing pressure drop and manufacturing complexity.

Implementation Method 1

The internal face includes a plurality of projections that project into the internal coolant passage and that are configured for transfer of heat from the electronics device to a flow of coolant through the internal passage

Methodology Applied

Scientific EffectHeat transfer: Convection

Implementation Method 2

The thermal support structure includes an external support face that supports the electronics device and that is thermally coupled thereto

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20260075753A1Fluid-cooled thermal support structure for electronics device having array of projections with non-uniform arrangement

Publication Date: 2026.03.12 GARRETT TRANSPORTATION I INC

AI summary

A system for an electronics device includes a thermal support structure with a fluid inlet, a fluid outlet, and an internal coolant passage extending in a downstream direction from the fluid inlet to the fluid outlet. The thermal support structure includes an external support face that supports the electronics device and that is thermally coupled thereto. Furthermore, the thermal support structure includes an internal face that partly defines the internal coolant passage. The internal face includes a plurality of projections that project into the internal coolant passage and that are configured for transfer of heat from the electronics device to a flow of coolant through the internal passage. The plurality of projections is arranged into an array that extends along the downstream direction. A spacing in the array between neighboring ones of the plurality of projections is non-uniform along the downstream direction. The spacing gradually decreases along the downstream direction.