Fluid-Cooled Inverter Packaging for High Power Density

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Solution Overview

Problem

Prior inverter systems for electric vehicles are large, bulky, inefficient, and expensive, with limited power density, making them unsuitable for compact and high-power applications.

Innovation Solution

The development of compact inverter systems that utilize packaged switch modules with ceramic or thin-film decoupling capacitors, allowing for a significant reduction in size while maintaining high power delivery, achieved through innovative packaging and thermal management techniques.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If traditional inverter systems are used, then power delivery capability is achieved, but system volume and weight are excessive

Engineering Contradiction:
Improvepower delivery capabilityVSAvoidsystem volume
Core Design Contradiction:
PowerVSVolume of moving object

Solution Approach 1:

The patent combines multiple functions into integrated modules: the power inverter module integrates DC to AC conversion components, the heat sink module combines thermal management with structural support, and the fluid cooled package merges electrical connections with cooling channels. This functional integration eliminates the need for separate cooling systems and mounting structures, achieving 400 kW peak power in under 0.25 liters.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent implements nested packaging where the power inverter module is housed within the fluid cooled package, which is in turn integrated with the heat sink module. The housing contains both electrical components and cooling fluid channels in a nested arrangement, with the cooling fluid flowing through channels that are embedded within the structural housing itself, maximizing space utilization.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Power

If traditional inverter systems are used, then power delivery is achieved, but manufacturing cost is high

Engineering Contradiction:
Improvepower delivery capabilityVSAvoidmanufacturing cost
Core Design Contradiction:
PowerVSEase of manufacture

Solution Approach 1:

The patent divides the inverter system into modular units: individual power inverter modules that can be manufactured separately, standalone heat sink modules, and fluid cooled packages. These modules are designed for standardized manufacturing and assembly, reducing tooling costs and enabling economies of scale while maintaining 400 kW peak power capability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent changes material parameters to reduce cost: using aluminum for heat sink construction instead of copper, employing ceramic or thin-film decoupling capacitors, and selecting cost-effective dielectric materials for electrical isolation. These parameter changes maintain thermal and electrical performance while significantly reducing material costs.

Inventive Principle:
Principle #35Parameter changes

3Volume of moving object

If compact packaging is implemented, then volume is reduced, but thermal management becomes more challenging

Engineering Contradiction:
Improvesystem volumeVSAvoidthermal management
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The patent introduces cooling fluid as an intermediary heat transfer medium that flows through channels embedded in the housing and heat sink structures. This fluid intermediary enables efficient heat removal from the power inverter module in the compact volume, carrying thermal energy away from concentrated heat sources to external dissipation points.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces traditional air-based or radiative cooling mechanisms with fluid-based convection cooling. The liquid or gas coolant provides superior heat transfer coefficients, enabling effective thermal management in the compact 0.25-liter volume where conventional cooling would be insufficient for 400 kW peak power dissipation.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

4Power

If traditional inverter systems are used, then power delivery is achieved, but power density is limited

Engineering Contradiction:
Improvepower delivery capabilityVSAvoidpower density
Core Design Contradiction:
PowerVSProductivity

Solution Approach 1:

The patent transitions from planar or distributed component layouts to three-dimensional stacked arrangements. Power inverter modules, heat sinks, and fluid channels are arranged in vertical layers, utilizing the third dimension to pack more functional elements into the available volume. This 3D integration achieves over 1 MW/liter power density for 400 kW peak power output.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The compact inverter systems deliver 400 kW of peak power in a volume less than 0.25 liters, significantly improving power density and efficiency compared to traditional systems.

Implementation Method 1

fluid cooled package...cooling fluid can flow

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

cooling fluid can flow through one or more channels

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS11967899B2Fluid cooled inverter
Publication Date: 2024.04.23 MAREL POWER SOLUTIONS INC
  • US11967899B2 patent drawing
  • US11967899B2 patent drawing
  • US11967899B2 patent drawing

AI summary

A compact inverter system includes a bus bar. The bus bar includes a terminal for connection to a positive terminal of a DC voltage supply. The compact inverter also includes a heat sink, a first transistor, and a second transistor. The first transistor has first and second terminals between which current is transmitted when the first transistor is activated, and a first gate terminal controlling the first transistor. The first terminal of the first transistor is thermally and electrically connected to the bus bar. The second transistor has first and second terminals between which current is transmitted when the second transistor is activated, and a second gate terminal controlling the second transistor. The first terminal of the second transistor is thermally and electrically connected to the heat sink. The first and second transistors are positioned between the bus bar and the heat sink. The first transistor is positioned between the second transistor and the bus bar. The second transistor is positioned between the first transistor and the heat sink.