Fluid-Cooled LED System Resolving Thermal Orientation Constraints
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Solution Overview
Problem
High lumen light emitting diodes (LEDs) face challenges in maintaining a p-n junction temperature below 60°C due to heat buildup, which limits their efficiency, lifespan, and orientation options, especially when multiple LEDs are densely packed on a printed circuit board.
Innovation Solution
A fluid-cooled LED system where a liquid coolant transfers heat from the p-n junction to a surrounding medium, allowing for efficient heat dissipation and potentially using the fluid to generate power through a turbine, thereby stabilizing the p-n junction temperature and reducing energy consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks are used to cool LEDs, then heat dissipation is improved, but device orientation is limited and size increases
Solution Approach 1:
The patent employs a liquid cooling system where coolant flows through channels in the PCB to remove heat from LEDs. This hydraulic cooling method replaces traditional air-cooled heat sinks, enabling flexible LED placement in any orientation since liquid cooling does not rely on gravity-dependent convection and can be integrated into the circuit board structure itself.
2Illumination intensity
If multiple LEDs are placed in close proximity, then light output is increased, but heat buildup accelerates and exceeds dissipation capacity
Solution Approach 1:
The patent combines multiple cooling functions into a single integrated PCB structure. The circuit board serves simultaneously as the electrical connection medium, mechanical support structure, and heat dissipation system through embedded coolant channels. This merging allows densely packed LEDs to share a common cooling infrastructure, efficiently managing heat from multiple sources without requiring individual heat sinks for each LED.
3Temperature
If heat sinks are made larger to dissipate more heat, then temperature control is improved, but device size increases
Solution Approach 1:
The patent transitions from three-dimensional protruding heat sinks to a two-dimensional planar cooling solution integrated into the PCB. Coolant channels are embedded within the circuit board plane, allowing heat dissipation to occur across the board's surface area rather than requiring additional vertical space. This dimensional transformation enables efficient heat removal while maintaining a compact form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The fluid-cooled LED system effectively maintains the p-n junction temperature, increases the lifespan and efficiency of LEDs, and allows for more flexible placement options by efficiently dissipating heat, while also providing a means to harness energy from the heat transfer.
Implementation Method 1
A fluid, preferably a liquid, cools and stabilizes the p-n junction of the light emitting diode
Implementation Method 2
Fluid under pressure can be used to turn a turbine integrated into the pipe that supplies the fluid to the LED
Data Source
AI summary
A fluid cooled light emitting diode and associated lighting unit is disclosed. A fluid, preferably a liquid, cools and stabilizes the p-n junction of the light emitting diode thereby reducing the energy required to power the light emitting diode, lengthening its usable lifetime, and outputting more consistent light. The fluid cools the lens surrounding the light emitting diode, a printed circuit board on which the light emitting diode resides, or other heat transferring elements proximate to the lens of the light emitting diode.