Fluid-Cooled Power Module With Spray-Jet Heat Dissipation
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Solution Overview
Problem
High-power semiconductor devices face inefficiencies in heat dissipation due to conventional heat sinks, which can lead to overheating, reliability issues, and increased operating costs, limiting power density and system speed.
Innovation Solution
A fluid-cooled power module with a direct-bonded metal structure and a cooling unit featuring separate inlet and outlet chambers connected by jets, where a cooling fluid is pressurized to form a spray that impinges on the metal structure, enhancing heat dissipation while reducing weight and cost compared to traditional metal-based solutions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional heat sinks are used for high-power semiconductor devices, then heat dissipation is achieved, but the system experiences overheating, reduced reliability, and increased operating costs
Solution Approach 1:
The patent implements a liquid cooling system where coolant flows through channels in the DBM structure to directly remove heat from the semiconductor die. This hydraulic cooling approach replaces conventional air-cooled heat sinks, enabling more efficient heat transfer and maintaining lower operating temperatures, thereby improving device reliability
Solution Approach 2:
The cooling channels are integrated within the DBM structure itself, nesting the cooling function inside the substrate. The coolant pathways are formed within the metal layers of the DBM, allowing heat to be extracted directly at the source without requiring separate external heat sinks, thus improving thermal management and reliability
2Loss of energy
If conventional metal-based heat sinks are used, then heat dissipation is achieved, but weight and cost increase by up to 50-75%
Solution Approach 1:
The patent employs a direct-bonded metal structure consisting of alternating metal and dielectric layers. This composite construction integrates heat dissipation functionality within the substrate itself rather than using separate metal heat sinks, achieving effective thermal management while significantly reducing overall weight and material cost
Solution Approach 2:
The cooling function is merged with the substrate structure by integrating coolant channels directly into the DBM layers. This combines the mechanical support function with the thermal management function in a single integrated component, eliminating the need for separate heavy metal heat sinks and reducing overall system weight
3Productivity
If conventional heat dissipation methods are used, then basic cooling is achieved, but power density and system speed are limited
Solution Approach 1:
The DBM structure is pre-designed with integrated cooling channels during manufacturing, establishing heat dissipation pathways before the semiconductor devices are mounted. This preliminary integration of cooling infrastructure enables immediate heat removal from the moment devices operate, preventing heat accumulation that would limit system speed and power density
Solution Approach 2:
The liquid cooling system uses forced convection of coolant through channels to actively transport heat away from the semiconductor die. This hydraulic heat removal mechanism provides superior cooling capacity compared to passive air cooling, enabling higher power density and faster system operation without thermal limitations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat, reducing temperature rise by 2-8 degrees Celsius, improving reliability, and decreasing the weight and cost of the heat sink by up to 50-75% compared to traditional metal-based systems.
Implementation Method 1
a cooling fluid, when flowing through the fluid path, absorbs heat from at least a portion of the direct-bonded metal structure
Implementation Method 2
a cooling fluid, when flowing through the fluid path, absorbs heat from at least a portion of the direct-bonded metal structure
Data Source
AI summary
A fluid-cooled power module is disclosed for cooling high power semiconductor devices. Semiconductor dies supported by a direct-bonded metal structure are attached to a cooling unit that circulates coolant from an inner chamber, through spray jets, to an outer chamber, so that coolant impinges onto a metal surface in thermal contact with the direct-bonded metal structure. Use of the cooling fluid provides more efficient and cost effective cooling than relying on a solid metal heat sink. The disclosed fluid-cooled power modules can reduce the cost and weight of heat dissipation for compatibility with aerospace applications.