Fluid Cooling Backplane for Information Handling Resources
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Solution Overview
Problem
Traditional air-cooling methods for information handling systems become inefficient as they require more powerful fans and increased airflow, leading to higher power consumption, larger system sizes, and excessive noise, while also failing to maintain optimal temperatures.
Innovation Solution
A fluid cooling system utilizing a chassis with modular information handling resources and a cooling backplane featuring fluidic columns and quick disconnect fittings, allowing for efficient circulation of a cooling fluid through fluid conduits to effectively dissipate heat from information handling resources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling with fans is used to cool information handling resources, then cooling capability is provided, but power consumption increases and system size increases
Solution Approach 1:
The patent replaces air cooling with liquid cooling by circulating coolant through channels formed in the substrate. The coolant absorbs heat from the back of the substrate where electronic components are mounted, transferring thermal energy away from the information handling resources without requiring high-power fans.
Solution Approach 2:
The patent substitutes the mechanical fan-based air cooling system with a liquid circulation system using pumps and heat sinks. This replacement eliminates the need for powerful moving fans while providing more efficient heat removal through liquid convection and phase change in external heat sinks.
2Temperature
If air cooling with fans is used to cool information handling resources, then cooling capability is provided, but system size increases
Solution Approach 1:
The patent integrates cooling channels directly within the substrate structure itself. The coolant flow paths are formed as cavities or channels inside the substrate material, nesting the cooling system within the existing structural component rather than adding separate external cooling apparatus.
Solution Approach 2:
The patent combines the substrate structural function with the cooling channel function into a single integrated component. The substrate simultaneously provides mechanical support for electronic components and serves as the coolant flow path, merging structural and thermal management functions.
3Temperature
If air cooling with fans is used to cool information handling resources, then cooling capability is provided, but noise increases
Solution Approach 1:
The patent uses liquid coolant circulation instead of high-velocity air flow generated by fans. Liquid cooling operates quietly through pumped flow through channels, eliminating the aerodynamic noise generated by fast-moving air and fan blades.
4Temperature
If fan power is increased to provide adequate cooling, then cooling capability is improved, but power consumption increases
Solution Approach 1:
The patent employs liquid cooling with pumps that require significantly less power than high-velocity fans to achieve equivalent or superior cooling. The liquid coolant has higher heat capacity and thermal conductivity, allowing efficient heat removal at lower flow velocities and pressures.
Solution Approach 2:
The patent utilizes phase change (evaporation/condensation) in external heat sinks to transfer heat from the coolant to the environment. This phase transition process provides high heat transfer efficiency without requiring additional mechanical power input.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The fluid cooling system reduces the disadvantages of traditional air-cooling methods by enhancing heat dissipation efficiency, minimizing power consumption, and maintaining lower operating temperatures, thus improving the performance and reliability of information handling systems.
Implementation Method 1
a fluid cooling system utilizing a network of fluidic columns and quick disconnect fittings that convey a cooling fluid through modular information handling resources, allowing for efficient heat transfer and recirculation
Implementation Method 2
a first fluidic column configured to conduct a fluid, a second fluidic column configured to conduct the fluid
Data Source
AI summary
A method may comprise causing a fluid to flow from a first fluidic column primary quick disconnect fluid fitting through a first fluidic column, the first fluidic column primary quick disconnect fluid fitting fluidically coupled to the first fluidic column and configured to couple to a first quick disconnect fluid fitting of a fluid network port. The method may also comprise causing the fluid to flow from the first fluidic column through at least one first fluidic column secondary quick disconnect fluid fitting having a fluidic network of corresponding information handling resource fluidically coupled thereto, the at least one first fluidic column secondary quick disconnect fluid fitting fluidically coupled to the first fluidic column and the fluidic network having one or more fluid conduits for conveying the fluid proximate to the information handling resource.