Fluid Cooling Element with Movable Base for PCB Thermal Contact
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Solution Overview
Problem
Existing fluid-based cooling systems for printed circuit boards (PCBs) face sub-optimal cooling due to varying stack-up tolerances among PCB components, leading to inadequate thermal and mechanical contact, especially with components having higher height deviations.
Innovation Solution
A fluid-based cooling element with a movable body and deformable element, allowing adjustable positioning to accommodate varying component heights, combined with standoff members and a flexible membrane for secure sealing and fixation, ensuring optimal thermal and mechanical contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a preadjusted base height is used for the cooling element, then the structure is simple and manufacturing is easy, but the cooling performance becomes sub-optimal due to insufficient steady contact with PCB components having high stack-up tolerances
Solution Approach 1:
The cooling element incorporates a movable base portion that can dynamically adjust its height position along the vertical axis. This dynamic adjustment allows the cooling element to adapt to varying PCB component heights while maintaining optimal thermal contact, resolving the contradiction between simple fixed structure and reliable adaptive cooling performance
Solution Approach 2:
The invention changes the height parameter of the cooling element's base portion, allowing it to vary within a specific range to match different PCB component heights. This parameter adjustment enables the cooling element to maintain steady thermal contact despite variations in component stack-up tolerances, improving cooling reliability without complicating manufacturing
2Reliability
If excessive mechanical forces are applied to compensate for sub-optimal cooling, then thermal contact is improved, but the risk of damaging PCB components increases
Solution Approach 1:
The movable base portion allows the cooling element to dynamically adapt its position to match PCB component heights, eliminating the need for excessive mechanical forces. This dynamic adjustment ensures optimal thermal contact is achieved through geometric alignment rather than mechanical pressure, protecting PCB components from damage
Solution Approach 2:
The invention introduces a movable base portion as an intermediary mechanism between the cooling element and PCB components. This intermediary allows for height adjustment and adaptation, enabling thermal contact optimization without applying excessive mechanical stress to the PCB components
3Reliability
If thick thermal bridge elements are used to compensate for height variations, then mechanical contact is improved, but heat conductivity decreases due to lower thermal conductivity of thermal interface materials
Solution Approach 1:
The movable base portion dynamically adjusts the position of the cooling element to achieve proper mechanical contact with PCB components of varying heights. This eliminates the need for thick thermal bridge elements, allowing the use of thin, high-thermal-conductivity interface materials that minimize thermal resistance and energy loss
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient cooling of heat-generating elements on PCBs with high stack-up tolerances by maintaining steady thermal and mechanical contact, enhancing cooling performance across a range of component heights.
Implementation Method 1
a fluid chamber (42) for receiving a cooling fluid... optimal thermal and mechanical contact
Implementation Method 2
The deformable element is in contact with the movable body for movably supporting the movable body, such that the movable body is movable towards or away from the fluid chamber
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
A fluid-based cooling element (10) for cooling a heat generating element (202, 204) arranged on a printed circuit board (PCB) (200) comprises a fluid chamber (42) for receiving a cooling fluid, a movable body (22) being in fluidic contact with the fluid chamber (42) on an upper side of the movable body (22), and a deformable element (20a; 20b; 20c; 20d) being in contact with the movable body (22). The movable body (22) has a base portion (24) having a first lower surface (25a) facing away from the fluid chamber (42). The deformable element (20a; 20b; 20c; 20d) is configured for movably supporting the movable body (22) such that the movable body (22) is movable towards or away from the fluid chamber (42) in a direction (P1, P2) perpendicular to an inner upper surface (43) of the fluid chamber (42), such that the position of the first lower surface (25a) of the base portion (24) of the movable body (22) is adjustable in dependence on a variable height of the heat generating element (202, 204) arranged on the printed circuit board (200).