Fluid Coupling Probe for Ultra-Small Component Assembly

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Solution Overview

Problem

Conventional mechanical and vacuum grippers are inadequate for assembling small electronic components due to size limitations, maneuverability issues, and reduced force effectiveness, making it difficult to handle ultra-small components like motes without damaging them or achieving precise placement.

Innovation Solution

The use of a fluid coupling droplet on an assembly probe that utilizes capillary forces to pick and place small electronic components, allowing for precise orientation and placement without mechanical gripping or vacuum suction, with the ability to adjust the droplet size and surface wettability to suit different components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If mechanical grippers are made smaller to handle ultra-small components, then the component size they can handle decreases, but the maneuverability and mechanical interference issues worsen

Engineering Contradiction:
Improvecomponent sizeVSAvoidmaneuverability
Core Design Contradiction:
Volume of moving objectVSEase of operation

Solution Approach 1:

The patent replaces the mechanical gripper system with a fluid-based capillary adhesion system. Instead of using mechanical fingers to grasp components, the invention uses a fluid coupling droplet that creates capillary forces to attach and detach components. This substitution eliminates the mechanical interference and maneuverability problems that plague miniaturized mechanical grippers while enabling handling of ultra-small components like motes.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention employs a fluid coupling droplet (liquid bridge) between the probe and the component to create capillary adhesion forces. By controlling the presence and properties of this fluid droplet, the system can attach and release components without mechanical contact. This hydraulic approach allows precise control over very small components while avoiding the mechanical interference issues that limit gripper maneuverability in tight spaces.

Inventive Principle:
Principle #29Pneumatics and hydraulics

2Volume of moving object

If mechanical grippers are designed to handle small components, then the component size they can handle decreases, but the assembly speed and throughput decrease

Engineering Contradiction:
Improvecomponent sizeVSAvoidassembly speed
Core Design Contradiction:
Volume of moving objectVSProductivity

Solution Approach 1:

The patent replaces slow mechanical gripping and releasing operations with rapid fluid-based capillary adhesion and detachment. The fluid coupling droplet can be quickly formed and broken, enabling much faster component handling cycles compared to mechanical grippers that require precise positioning and force control. This substitution dramatically increases throughput while maintaining the ability to handle ultra-small components.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention uses periodic application and removal of the fluid coupling droplet to create rapid attach-detach cycles. By controlling the fluid presence in a periodic manner, the system achieves high-speed component handling without the slow, deliberate movements required by mechanical grippers. This periodic fluid action enables throughput comparable to or exceeding traditional assembly methods while handling much smaller components.

Inventive Principle:
Principle #19Periodic action

3Volume of moving object

If vacuum grippers are used to pick up small components, then the component size decreases, but the effective force decreases

Engineering Contradiction:
Improvecomponent sizeVSAvoideffective force
Core Design Contradiction:
Volume of moving objectVSForce

Solution Approach 1:

The patent changes the fundamental parameter of adhesion force from vacuum pressure to capillary force. Instead of relying on vacuum suction which scales with surface area (and thus fails for very small components), the invention uses capillary forces in a fluid droplet that scale differently with size. The capillary force depends on surface tension and droplet geometry rather than component surface area, maintaining effective force even as component size decreases to the mote scale.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention uses a fluid coupling droplet to generate capillary adhesion forces that are much stronger relative to component size than vacuum forces. The capillary force arises from the curved meniscus in the fluid droplet creating negative pressure and surface tension effects that strongly bind to small components. This hydraulic approach provides sufficient holding force for ultra-small components where vacuum grippers become ineffective due to their tiny surface areas.

Inventive Principle:
Principle #29Pneumatics and hydraulics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient and precise assembly of small electronic components by leveraging capillary forces, overcoming the limitations of traditional grippers in terms of size, force, and maneuverability, while allowing for orientation adjustments and secure attachment to substrates.

Implementation Method 1

The use of a fluid coupling droplet on an assembly probe that utilizes capillary forces to pick and place small electronic components

Methodology Applied
Scientific EffectCapillary forces: Capillary Action

Data Source

PatentUS10278318B2Method of assembling an electronic component using a probe having a fluid thereon
Publication Date: 2019.04.30 INTEL CORP
  • US10278318B2 patent drawing
  • US10278318B2 patent drawing
  • US10278318B2 patent drawing

AI summary

A method of assembly comprising providing an assembly probe, the assembly probe having an end coupling face; providing a droplet of fluid on the end coupling face of the assembly probe; coupling an electronic component to the end coupling face of the assembly probe with the fluid droplet, the electronic component having a peripheral dimension equal to or less than 2 mm in each of length, width and height; placing the electronic component on a substrate with the assembly probe; decoupling the electronic component from the end coupling face of the assembly probe; and assembling the electronic component to the substrate.