Fluid-Cushion Thermal Platform for Uniform Wafer Heating
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Solution Overview
Problem
Current thermal treatment systems for wafers and FPD substrates face issues such as long temperature stabilization times, non-homogeneous temperature distribution due to contact with chucks, potential damage from contact, and risks of electrostatic discharge and contamination.
Innovation Solution
A non-contact thermal treatment system using fluid-mechanical platforms with pressure outlets and fluid-evacuation channels, employing fluid-cushion technology to support objects without contact, utilizing flow restrictors for uniform temperature control and preventing physical contact through fluidic return spring behavior.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If contact heating/cooling is used, then thermal treatment can be applied, but temperature distribution becomes non-homogeneous due to hot or cold spots
Solution Approach 1:
A fluid cushion acts as an intermediary between the thermal platform and the wafer, enabling thermal treatment without direct contact. The fluid medium transfers heat uniformly across the wafer surface, eliminating hot and cold spots that occur with contact-based heating methods.
Solution Approach 2:
The system uses pneumatic fluid cushion technology to support and thermally treat the wafer. Pressurized fluid is supplied through flow restrictors to create a uniform fluid layer between the thermal platform and wafer, ensuring homogeneous temperature distribution during thermal processing.
2Productivity
If contact with chuck is used, then thermal treatment is efficient, but damage such as backside contamination and ESD may occur
Solution Approach 1:
The fluid cushion serves as a protective intermediary layer between the thermal platform and the wafer, enabling efficient thermal treatment while preventing direct contact damage including backside contamination, scratches, and electrostatic discharge.
Solution Approach 2:
The patent replaces the mechanical contact system with a fluid-based thermal treatment system. Instead of using a solid chuck that physically contacts the wafer, the system uses a fluid cushion to transfer thermal energy, eliminating mechanical damage risks while maintaining thermal treatment efficiency.
3Adaptability or versatility
If multiple pre-heated chucks are used, then different temperatures can be applied, but system complexity increases
Solution Approach 1:
The thermal platform incorporates dynamic temperature control capabilities, allowing a single platform to be rapidly heated or cooled to different temperatures as needed. This dynamic adjustment capability replaces the need for multiple static pre-heated chucks, reducing system complexity while maintaining temperature versatility.
Solution Approach 2:
The thermal platform is designed as a universal device that can perform multiple thermal treatment functions at different temperatures. By integrating heating and cooling capabilities in a single platform, the system eliminates the need for multiple specialized chucks, simplifying the overall system architecture.
4Temperature
If contact between wafer and chuck is used, then thermal treatment can proceed, but slippage due to thermal expansion causes contamination
Solution Approach 1:
The fluid cushion acts as a mediator that allows thermal treatment to proceed while preventing wafer-chuck contact. The fluid layer accommodates thermal expansion and contraction without causing slippage, thereby preventing backside contamination while maintaining effective thermal processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves rapid and uniform temperature control, reduces the risk of damage and contamination, and ensures stable, efficient thermal processing with improved temperature homogeneity and reduced contact-related issues.
Implementation Method 1
at least one of the pressure outlets being fluidically connected through a flow restrictor to a high-pressure fluid supply, the flow restrictor characteristically exhibiting fluidic return spring behavior
Implementation Method 2
the pressure outlets providing pressurized fluid for maintaining a fluid-cushion between the object and the active-surface of the platform
Implementation Method 3
the heat may be transferred to the wafer via contact with the chuck, i.e., via a conductive heat transfer mechanism
Data Source
AI summary
A thermal treatment system comprising at least one apparatus for thermally treating an object, the apparatus comprising: one platform or two substantially opposite platforms, where at least one of the platforms has at least one thermal means for heating or cooling of the object; and at least one of the platforms has fluid-mechanical means for supporting the object without contact. The platform has an active surface comprising at least one of a plurality of basic cells, each basic cell having at least one of a plurality of pressure outlets and at least one of a plurality of fluid-evacuation channels. At least one of the pressure outlets of each basic cell is fluidically connected through a flow restrictor to a high-pressure fluid supply, the pressure outlets providing pressurized fluid for maintaining a fluid-cushion between the object and the active-surface of the platform. The flow restrictor characteristically exhibits fluidic return spring behavior. Each of the evacuation channels has an inlet and outlet, for locally balancing mass flow for the basic cells.