Fluid-Based Debonding of Semiconductor Carriers
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Solution Overview
Problem
Conventional methods for debonding temporary carriers from semiconductor devices often damage the carrier and/or the semiconductor device due to imprecise positioning of mechanical blades, and require frequent cleaning and replacement of the blade to avoid contamination.
Innovation Solution
A system using a fluid delivery device to direct a stream of fluid toward the interface between the carrier and the semiconductor device, loosening the adhesive layer and initiating debonding without mechanical damage, while a liftoff device completes the separation process, reducing contamination and maintenance needs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a mechanical blade is used to initiate debonding of the carrier, then the carrier can be separated from the semiconductor device, but the blade can damage the carrier and/or semiconductor device if not precisely positioned
Solution Approach 1:
The patent replaces the mechanical blade system with a fluid delivery system. Instead of using a physical blade that contacts the adhesive layer mechanically, a stream of fluid is delivered to the interface between the carrier and semiconductor device to initiate debonding. This substitution eliminates the risk of mechanical damage while maintaining effective carrier separation.
Solution Approach 2:
The patent introduces fluid as an intermediary substance between the debonding system and the carrier-semiconductor device interface. The fluid acts as a mediator that transfers the debonding action without requiring direct mechanical contact, thereby preventing damage to the carrier and semiconductor device while still achieving effective separation.
2Productivity
If a mechanical blade is used to initiate debonding, then the carrier can be separated from the semiconductor device, but the blade must be periodically cleaned and/or replaced
Solution Approach 1:
The patent replaces the mechanical blade that requires cleaning and replacement with a fluid delivery system. The fluid stream delivers the debonding action without contacting the adhesive layer in a way that causes contamination, eliminating the need for periodic cleaning and replacement operations.
Solution Approach 2:
The fluid delivery system is designed to maintain itself through the natural flow characteristics of the fluid. The continuous or periodic fluid flow prevents accumulation of adhesive material on the delivery components, allowing the system to maintain its debonding effectiveness over extended periods without manual intervention for cleaning or replacement.
3Object-affected harmful factors
If precise positioning is required for the blade to avoid damage, then damage to the carrier and semiconductor device is minimized, but the system complexity and time for positioning increase
Solution Approach 1:
The patent replaces the precision positioning requirement for a mechanical blade with a fluid delivery system that has inherent positioning flexibility. The fluid stream can be directed to the debonding interface without requiring the same level of positional precision as a mechanical blade, reducing both system complexity and positioning time.
Solution Approach 2:
The patent changes the physical state and delivery method from solid mechanical contact to fluid stream delivery. This parameter change allows for greater tolerance in positioning while still achieving effective debonding, as the fluid can adapt to slight variations in position whereas a rigid blade cannot.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The fluid-based debonding method minimizes damage to the semiconductor device and carrier, lowers operating costs by reducing the need for frequent cleaning and replacement of the fluid delivery device, and increases system uptime by allowing for more precise and efficient debonding.
Implementation Method 1
a fluid delivery device configured to direct a stream of fluid toward an interface between the temporary carrier and the semiconductor device
Data Source
AI summary
Systems and methods for debonding a carrier from a semiconductor device are disclosed herein. In one embodiment, a system for debonding a carrier from a semiconductor device includes a support member positioned to carry the semiconductor device and a fluid delivery device having an exit positioned to direct a fluid toward an adhesive layer between the carrier and the semiconductor device. The fluid directed from the fluid delivery device initiates debonding of the carrier from the semiconductor device by weakening or loosening at least a portion of the adhesive. The system further includes a liftoff device configured to releasably engage the carrier and apply a debonding force to the carrier to complete debonding of the carrier from the semiconductor device.