Fluid Directing Assembly Without Wax Release Agent
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Solution Overview
Problem
Adhesion between materials in inkjet printheads is inadequate, especially in high-temperature and chemically aggressive environments, leading to structural vulnerabilities at joints where ink components can cause damage.
Innovation Solution
Modified epoxy molding compounds without wax release agents are used to create a monolithic fluid directing assembly with enhanced joint strength by molding epoxy resin, cross-linker, and filler in contact with silicon dies and printed circuit boards, providing a strong bond resistant to ink degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional epoxy molding compounds with wax release agents are used, then ease of manufacture is improved, but adhesion strength and structural integrity deteriorate due to ink degradation and high temperature exposure
Solution Approach 1:
The patent removes the wax release agent from the epoxy molding compound formulation. This extraction eliminates the harmful component that causes poor adhesion when exposed to ink and heat, while retaining the manufacturing benefits of epoxy molding compounds.
Solution Approach 2:
The patent uses a composite material system consisting of epoxy resin combined with specific additives that provide both release functionality and strong adhesion. This composite approach allows the material to maintain ease of manufacture while achieving the required reliability and resistance to ink degradation.
2Strength
If materials are used that provide strong initial bonding, then joint strength is improved, but resistance to chemical degradation from ink components deteriorates
Solution Approach 1:
The patent modifies the chemical parameters of the epoxy molding compound by adjusting the resin-to-hardener ratio and selecting specific epoxy resin types that create a more chemically resistant bond. This parameter optimization allows the joint to maintain strength while resisting degradation from ink surfactants, solvents, and ionic additives.
Solution Approach 2:
The patent addresses the harmful effect of ink exposure by selecting epoxy formulations that actually benefit from the curing process under ink exposure conditions. The chemical interaction between the ink components and the modified epoxy creates a stronger, more durable bond over time rather than degrading it.
3Strength
If adhesion promoters are added to improve bonding, then joint strength is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines the adhesion promoter functionality directly into the epoxy molding compound formulation itself, eliminating the need for separate adhesion promotion steps. This merging of functions maintains strong bonding while avoiding additional manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves improved structural integrity and reliability of inkjet printheads by forming a strong adhesive bond between components, even in contact with caustic inks and high temperatures, reducing the risk of joint failure.
Implementation Method 1
a modified epoxy molding compound which includes at least epoxy resin, cross-linker, and filler, and is devoid of wax release agent, is molded in contact with the silicon die to form a joint
Data Source
AI summary
A fluid directing assembly can comprise a molded support comprising a modified epoxy molded compound which includes epoxy resin, cross-linker, filler, and is devoid of wax release agent. The assembly can also include a silicon die attached to the molded support and wherein the silicon die and the molded support define a fluid directing channel.