Fluid Distribution Unit Using Dielectric Two-Phase Cooling

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Solution Overview

Problem

Conventional cooling systems for data centers and electronic devices are inefficient and costly due to high energy consumption, noise, and inability to effectively manage high heat fluxes from next-generation microprocessors, leading to increased operating costs and potential hardware risks from water-based cooling systems.

Innovation Solution

A two-phase cooling system utilizing a fluid distribution unit with a reservoir, pumps, and a heat exchanger that employs dielectric coolant in a closed loop, allowing for efficient heat transfer through phase change and minimizing the risk of damage to electronic components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional air conditioning systems are used to cool data centers, then cooling capacity is provided, but energy consumption and operating costs increase significantly

Engineering Contradiction:
Improvecooling capacityVSAvoidenergy consumption
Core Design Contradiction:
TemperatureVSUse of energy by moving object

Solution Approach 1:

The patent employs two-phase dielectric coolant that undergoes phase change (evaporation and condensation) to transfer heat from electronic devices. The coolant evaporates at the heat source absorbing latent heat, then condenses in a heat exchanger releasing heat, providing efficient cooling with lower energy consumption compared to conventional air conditioning systems

Inventive Principle:
Principle #36Phase transitions

Solution Approach 2:

The invention replaces the mechanical compression-based vapor cycle typically used in air conditioning with an isochoric (constant volume) heat transfer system using dielectric coolant. This substitution eliminates the need for mechanical compressors and reduces energy consumption while maintaining effective cooling capacity

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Loss of energy

If water-based cooling systems are used, then efficient heat transfer is achieved, but risk of damage to electronic components increases

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidrisk of component damage
Core Design Contradiction:
Loss of energyVSObject-affected harmful factors

Solution Approach 1:

The patent introduces dielectric coolant as an intermediary substance between the heat source (electronic devices) and the heat sink. This dielectric fluid provides the heat transfer efficiency of liquid cooling while its insulating properties prevent electrical damage to components, serving as a safe mediator that combines the benefits of both liquid and air cooling

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention changes the electrical parameter (conductivity) of the cooling medium by using dielectric coolant instead of conductive water. This parameter change maintains the thermal properties needed for efficient heat transfer while eliminating the electrical conductivity that causes short circuits and component damage in water-based systems

Inventive Principle:
Principle #35Parameter changes

3Temperature

If forced air cooling systems are used, then cooling is provided, but noise levels increase

Engineering Contradiction:
Improvecooling effectVSAvoidnoise
Core Design Contradiction:
TemperatureVSObject-generated harmful factors

Solution Approach 1:

The patent replaces the mechanical fan-based forced air cooling system with a passive two-phase heat transfer system. The dielectric coolant naturally circulates through phase change and density differences, eliminating the need for high-speed fans and significantly reducing noise generation while maintaining effective cooling

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

4Temperature

If conventional cooling systems are used, then cooling is provided, but system complexity and cost increase

Engineering Contradiction:
Improvecooling capabilityVSAvoidsystem complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent divides the cooling system into distinct functional segments: a closed two-phase dielectric coolant loop for heat absorption, a heat exchanger for heat rejection, and natural circulation pathways. This segmentation allows each component to perform its function independently and simplifies the overall system architecture compared to integrated conventional cooling systems

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention enables the cooling system to self-regulate through natural convection and phase change of the dielectric coolant. The system automatically adjusts coolant flow and heat transfer rates based on thermal loads without requiring complex electronic controls or sensors, reducing system complexity while maintaining effective cooling capability

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system provides significant reductions in power consumption and heat transfer rates, enabling consistent lower operating temperatures for microprocessors, extending their lifespan and reducing downtime, while being safer and more compact than traditional cooling methods.

Implementation Method 1

A two-phase cooling system utilizing a fluid distribution unit with a reservoir, pumps, and a heat exchanger that employs dielectric coolant in a closed loop, allowing for efficient heat transfer through phase change

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 2

efficient heat transfer through phase change

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 3

A second pump can be fluidly connected to the heat rejection loop between the first end of the heat rejection loop and the second end of the heat rejection loop. The second pump can be located upstream of the heat exchanger and can be configured to circulate a flow of single-phase liquid coolant from the reservoir, through the heat exchanger, and back to the reservoir.

Methodology Applied
Scientific EffectHeat exchange: Heat Exchanger

Data Source

PatentUS10184699B2Fluid distribution unit for two-phase cooling system
Publication Date: 2019.01.22 EBULLIENT INC
  • US10184699B2 patent drawing
  • US10184699B2 patent drawing
  • US10184699B2 patent drawing

AI summary

A fluid distribution unit for a two-phase cooling system can include a reservoir configured to receive a two-phase flow of dielectric coolant. A first pump can be fluidly connected to a supply line extending from the reservoir. A heat rejection loop can be fluidly connected to the reservoir. The heat rejection loop can include a heat exchanger and a second pump. The second pump can be configured to circulate a flow of single-phase liquid coolant from the reservoir, through the heat exchanger, and back to the reservoir.