Fluid distribution unit for two-phase cooling system
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Solution Overview
Problem
Conventional cooling systems for data centers and electronic devices are inefficient, costly, and unable to handle the high heat fluxes expected from next-generation microprocessors, with existing liquid cooling systems posing risks and inefficiencies due to high flow rates, thermal resistance, and mechanical failures.
Innovation Solution
A redundant heat sink module with dual independent coolant pathways and impinging jet streams for enhanced heat transfer, utilizing dielectric coolants in a compact and reliable manner to manage high heat fluxes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional air conditioning systems are used to cool data centers, then cooling capacity is provided, but thermodynamic efficiency is poor and operating costs are high
Solution Approach 1:
The patent utilizes two-phase refrigerant flow (liquid-vapor transition) in the cooling loops to achieve efficient heat transfer. The refrigerant evaporates at the heat source (absorbing latent heat) and condenses at the heat exchanger (releasing latent heat), providing high thermodynamic efficiency and reducing operating costs compared to conventional air conditioning systems.
Solution Approach 2:
The invention employs liquid refrigerant circulation through sealed loops with pumps and heat exchangers, replacing air-based cooling with fluid-based thermal management. This hydraulic approach enables controlled, efficient heat removal with better thermodynamic performance and lower operating costs.
2Productivity
If high flow rates are used in liquid cooling systems, then heat transfer efficiency improves, but mechanical failures and risks increase
Solution Approach 1:
The system optimizes refrigerant flow parameters (flow rate, pressure, temperature) to achieve efficient heat transfer without excessive velocities that cause mechanical stress. The two-phase flow regime allows high heat transfer coefficients at moderate flow rates, maintaining reliability while improving productivity.
Solution Approach 2:
The patent implements localized cooling zones with targeted refrigerant distribution to heat sources. This allows efficient heat removal where needed without requiring high system-wide flow rates, reducing mechanical stress and failure risks while maintaining high heat transfer efficiency at critical locations.
3Productivity
If thermal resistance is reduced in cooling systems, then heat removal efficiency improves, but system complexity increases
Solution Approach 1:
The patent introduces a two-phase refrigerant as an intermediary heat transfer medium between heat sources and heat exchangers. The refrigerant's phase change properties provide low thermal resistance heat transfer without requiring complex direct-contact cooling systems, achieving high heat removal efficiency with manageable system complexity.
4Temperature
If cooling systems are designed for next-generation microprocessors, then heat flux handling capacity improves, but cost and complexity increase
Solution Approach 1:
The cooling system is divided into modular cooling loops, each serving specific heat sources (microprocessors, power supplies, etc.). This segmentation allows targeted heat removal from high heat flux components without requiring a completely complex system redesign, enabling scalable heat flux handling capacity with controlled complexity and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides efficient, scalable, and reliable cooling with reduced power consumption and mechanical stress, enabling consistent operation at lower temperatures and extending the life of electronic devices.
Implementation Method 1
a flow of subcooled single-phase liquid coolant passing through a cooling line into a heat sink module where it absorbs sensible heat
Implementation Method 2
where the single-phase liquid coolant is then transported from the first module to the second module where it absorbs latent heat resulting in formation of two-phase bubbly flow
Data Source
AI summary
A fluid distribution unit for a two-phase cooling system can include a reservoir configured to receive a two-phase flow of dielectric coolant. A first pump can be fluidly connected to a supply line extending from the reservoir. A heat rejection loop can be fluidly connected to the reservoir. The heat rejection loop can include a heat exchanger and a second pump. The second pump can be configured to circulate a flow of single-phase liquid coolant from the reservoir, through the heat exchanger, and back to the reservoir.