Fluid Ejection Dies Electrical Interconnect Flex Circuit
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Solution Overview
Problem
There is a need to reduce the width of semiconductor dies with fluid actuation devices to lower costs and improve manufacturability in inkjet printing systems, while maintaining effective electrical connectivity between multiple dies.
Innovation Solution
A fluid ejection device design featuring contact pads arranged in columns with a flex circuit connecting beams across individual dies, allowing for ganged thermal compression tape-automated bonding to interconnect multiple dies in a single step, enabling efficient electrical connection and reduced die width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the width of semiconductor dies is reduced to lower costs and improve manufacturability, then manufacturing cost and ease of manufacture are improved, but electrical connectivity between multiple dies becomes more difficult to maintain
Solution Approach 1:
The patent transitions from a lateral contact pad arrangement to a longitudinal arrangement, utilizing the length dimension of the die to position contact pads. This dimensional reorganization allows for narrower die width while maintaining sufficient spacing for electrical interconnection through the flex circuit, thereby resolving the contradiction between reduced manufacturability cost and maintained electrical connectivity.
Solution Approach 2:
The patent introduces a flex circuit as an intermediary element that bridges the contact pads on narrow dies. This flexible interconnect structure provides the necessary electrical connection between multiple dies while accommodating the reduced die width, thus maintaining reliability without compromising the ease of manufacture.
2Productivity
If contact pads are arranged in columns with flex circuit beams spanning across dies, then electrical interconnection efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges the electrical interconnection function into a single integrated flex circuit structure that spans across multiple dies. By combining multiple interconnect paths into one unified flexible circuit board with beam elements, the system achieves efficient electrical interconnection while avoiding the complexity of multiple separate rigid interconnect structures.
Solution Approach 2:
The patent employs a flexible circuit board with beam portions that can dynamically adapt to the physical layout requirements. The flex circuit's inherent flexibility allows it to conform to the die arrangement and provide reliable electrical connections without requiring complex rigid structural designs, thus improving interconnection efficiency while managing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables narrower semiconductor dies with improved manufacturability and cost-effectiveness by allowing for efficient electrical interconnection of multiple fluid ejection dies within an epoxy over-molded package, facilitating power delivery and data transfer while maintaining the functionality of fluid actuation devices.
Implementation Method 1
ganged thermal compression tape-automated bonding (tab) may be used to bond the beams to the contact pads of the multiple dies
Data Source
AI summary
A device includes a plurality of fluid ejection dies, wherein each of the fluid ejection dies includes a contact pad and a plurality of fluid actuation devices. The device includes an electrical interconnect element in contact with the contact pad of each of the fluid ejection dies to electrically interconnect the plurality of fluid ejection dies.