Fluid Flow-Path Cooling for Dense Electronic Packaging

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Solution Overview

Problem

Conventional electronic devices face poor heat dissipation efficiency due to a small heat dissipation area, which is exacerbated by the miniaturization and high density of electronic elements.

Innovation Solution

The electronic device incorporates a circuit layer, an electronic element, a first flow-path structure, and a fluid material. The electronic element is disposed on the circuit layer and is electrically connected to it. The first flow-path structure includes a flow path where the fluid material is used for heat exchange with the electronic element, improving heat transfer efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional packaging technology with bumps or contacts is used to electrically connect electronic elements, then electrical connection is achieved, but heat dissipation area is small resulting in poor heat dissipation efficiency

Engineering Contradiction:

Improveelectrical connectionVSAvoidheat dissipation efficiency

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent makes the connection structure serve dual functions: electrical connection and heat dissipation. The conductive layer and bumps/contacts are designed to simultaneously establish electrical connectivity and provide thermal conduction pathways, eliminating the need for separate heat dissipation structures and thereby increasing the effective heat dissipation area without compromising electrical connection reliability

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent extends heat dissipation from a point-contact dimension to a planar dimension by incorporating conductive layers that spread laterally beneath the electronic element. This dimensional expansion creates multiple heat conduction pathways and significantly increases the heat dissipation area, transforming the thermal management approach from localized to distributed

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design significantly enhances the heat transfer and dissipation efficiency of the electronic device by utilizing a fluid material within a flow-path structure for effective heat exchange with the electronic element.

Implementation Method 1

The fluid material is used for performing heat exchange with the electronic element

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 2

The fluid material is disposed in the first flow path and used for performing heat exchange with the electronic element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250140645A1Electronic device

Publication Date: 2025.05.01 INNOLUX CORP

AI summary

An electronic device including a circuit layer, an electronic element, a first flow-path structure and a fluid material is disclosed. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The first flow-path structure includes a first flow path, and the electronic element is disposed in the first flow-path structure. The fluid material is disposed in the first flow path. The fluid material is used for performing heat exchange with the electronic element. The circuit layer includes an input hole and an output hole, and the fluid material enters the first flow path through the input hole and exits the first flow path through the output hole.