Fluid Jet Substrate Polishing for Bevel Region Planarization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate cleaning processes for semiconductor devices, such as abrasive cleaning, may leave unwanted materials like particles or metallic contaminants on the substrate, and fail to effectively polish the surface, particularly in areas like the bevel region.
Innovation Solution
A substrate treating apparatus and method that involves jetting a fluid containing abrasives onto the substrate using a nozzle unit, which includes a supporting unit to stabilize the substrate and a supplying unit to control the fluid composition and pressure, allowing for precise polishing and surface planarization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional mechanical polishing tools (polishing brush, belt, or pad) are used, then the substrate surface can be polished, but the bevel region and other challenging areas cannot be effectively polished and contaminants remain
Solution Approach 1:
The patent replaces conventional mechanical polishing tools (brushes, belts, pads) with a fluid jet system that delivers abrasive particles through high-pressure fluid flow. This substitution enables effective polishing of the bevel region and other challenging areas that were inaccessible to mechanical tools, while removing contaminants more thoroughly through the dynamic impact and penetration capability of the jetted fluid.
2Productivity
If abrasive cleaning is performed using conventional tools, then some surface polishing occurs, but unwanted materials like particles and metallic contaminants are not completely removed
Solution Approach 1:
The patent employs a hydraulic system that jets fluid containing abrasive particles onto the substrate surface at high velocity. This hydraulic approach delivers the abrasive material with sufficient kinetic energy to penetrate and remove stubborn contaminants such as particles and metallic residues that conventional abrasive cleaning tools cannot completely eliminate, thereby improving both cleaning efficiency and contaminant removal completeness.
Solution Approach 2:
The patent changes the delivery parameters of the abrasive material by transitioning from mechanical application to fluid jet delivery. By controlling fluid pressure, flow rate, and abrasive particle concentration, the system optimizes the impact energy and distribution of abrasives, enabling more effective removal of unwanted materials while maintaining high cleaning efficiency.
3Ease of operation
If mechanical polishing tools are used, then the polishing process can be performed, but the process is complex and cannot access certain substrate areas
Solution Approach 1:
The patent replaces complex mechanical polishing tools with a simpler fluid jet system that can easily access and polish the bevel region and other challenging substrate areas. The fluid jet approach eliminates the complexity of mechanical tool positioning and contact while providing superior adaptability to various substrate geometries and hard-to-reach regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively removes contaminants and achieves surface planarization by using a controlled jet polishing process, improving the efficiency and effectiveness of substrate cleaning, especially in areas that are challenging for conventional mechanical polishing tools.
Implementation Method 1
jetting a fluid containing an abrasive onto a substrate
Implementation Method 2
polishing the substrate using the jetted fluid
Data Source
AI summary
A substrate treating method may include jetting a fluid containing an abrasive onto a substrate, and polishing the substrate using the jetted fluid.