Integrated Fluid Manifold Assembly for Precise Semiconductor Flow Control
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Solution Overview
Problem
Current mass flow control systems in semiconductor fabrication face challenges in delivering precise and varied flow rates of gases and liquids, requiring more complex and compact designs to meet increasing performance demands while maintaining efficiency and cost-effectiveness.
Innovation Solution
The system comprises a manifold assembly with multiple fluid supply apparatuses, each with an inlet, outlet, and bleed port, connected to vacuum and outlet manifolds, allowing for precise control and delivery of process fluids through a network of primary and feed channels, and incorporating valve assemblies and flow restrictors for accurate flow management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If traditional mass flow control systems are used, then flow control functionality is provided, but system complexity and space requirements increase
Solution Approach 1:
The patent combines multiple flow control apparatuses and manifold functions into an integrated manifold assembly. The first and second apparatuses for controlling flow are mounted on a single manifold structure with shared vacuum and outlet manifolds, reducing the number of separate components while maintaining precise flow control capabilities through integrated design
Solution Approach 2:
The manifold assembly serves multiple functions simultaneously: it provides flow control through multiple apparatuses, collects vacuum through a shared vacuum manifold, directs output through an outlet manifold, and incorporates both pre-filter and post-filter sections for comprehensive filtration. This multi-functionality reduces overall system complexity while maintaining reliability
2Manufacturing precision
If flow control precision is improved, then manufacturing precision is enhanced, but device complexity increases
Solution Approach 1:
The flow control system is segmented into distinct functional sections: pre-filter section, first apparatus for controlling flow, post-filter section, and filtration section. Each segment performs a specific function with dedicated components, allowing precise flow control in each section while organizing complexity into manageable, modular units
Solution Approach 2:
The patent utilizes vertical stacking of components along the fluid flow path, arranging filters and flow control apparatuses in a layered configuration. This three-dimensional arrangement allows multiple precision control elements to be integrated without proportionally increasing horizontal space requirements, managing complexity through spatial optimization
3Volume of moving object
If system compactness is increased, then space requirements are reduced, but ease of manufacture decreases
Solution Approach 1:
The manifold assembly nests multiple components within a compact structure: filters are positioned within the fluid flow path, flow control apparatuses are mounted on the manifold body, and vacuum ports are integrated into the same structure. This nested arrangement achieves high compactness while maintaining reasonable assembly accessibility
Solution Approach 2:
The compact manifold assembly is designed as a modular unit with distinct segments (pre-filter section, flow control apparatus, post-filter section) that can be manufactured separately and then assembled together. This segmentation allows each component to be optimized for compactness while maintaining ease of assembly through standardized interfaces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables enhanced precision, repeatability, and flexibility in fluid flow control, supporting advanced semiconductor fabrication processes while reducing space and maintenance complexity, thereby improving overall system performance and efficiency.
Implementation Method 1
a vacuum source fluidly coupled to the vacuum manifold
Data Source
AI summary
Systems for processing articles are essential for semiconductor fabrication. In one embodiment, a system is disclosed comprising a plurality of fluid supplies configured to supply process fluids, a plurality of apparatuses for controlling flow, a plurality of mounting substrates, a vacuum manifold fluidly coupled to the plurality of mounting substrates, an outlet manifold fluidly coupled to the plurality of mounting substrates, a vacuum source fluidly coupled to the vacuum manifold, and a processing chamber fluidly coupled to the outlet manifold. The plurality of apparatuses for controlling flow have a bleed port and an outlet. The outlets of the plurality of apparatuses are fluidly coupled to corresponding outlet ports of the plurality of mounting substrates. The bleed ports of the plurality of apparatuses are fluidly coupled to the corresponding vacuum ports of the plurality of mounting substrates.