Fluid Pad Conditioner for CMP Scratch Reduction
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Solution Overview
Problem
The complexity of integrated circuit (IC) processing and manufacturing, particularly in planarization technologies like CMP, is increased by the variability in material removal rates due to the roughness of the planarization pad, which can lead to scratch defects on wafers.
Innovation Solution
A pressurized fluid material is dispensed onto the planarization pad to maintain its roughness and remove residues, using a pad conditioner with a rotatable plate and nozzle openings to ensure efficient reconditioning, reducing the need for diamond plates and minimizing scratch defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If diamond plate is used for reconditioning the planarization pad, then the pad surface can be restored, but scratch defects are caused on CMP-processed wafers due to cracked diamonds
Solution Approach 1:
The patent replaces the mechanical diamond plate reconditioning system with a fluid-based reconditioning system. Pressurized fluid is delivered through a fluid delivery unit onto the planarization pad surface, substituting the mechanical contact of diamond particles with a non-contact or minimal-contact fluid mechanism, thereby eliminating scratch defects while maintaining pad reconditioning effectiveness
Solution Approach 2:
The patent employs pressurized fluid delivery through nozzles or a fluid delivery unit to achieve pad reconditioning. The hydraulic or pneumatic system delivers controlled streams of fluid onto the pad surface, using fluid pressure and flow dynamics to remove residues and restore pad surface properties without the mechanical damage caused by diamond plates
2Manufacturing precision
If the planarization pad roughness varies, then the material removal rate becomes unstable, but using traditional reconditioning methods causes scratch defects
Solution Approach 1:
The patent replaces mechanical reconditioning with fluid-based reconditioning to stabilize material removal rates. The pressurized fluid system restores pad surface roughness uniformly without introducing scratch defects, ensuring consistent CMP processing performance and stable material removal rates across the wafer surface
Solution Approach 2:
The patent changes the reconditioning mechanism from mechanical to fluid-based, altering the physical parameters of the reconditioning process. By controlling fluid pressure, flow rate, and delivery timing, the system optimizes pad surface restoration while maintaining manufacturing precision and eliminating harmful scratch defects
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach stabilizes the material removal rate and reduces scratch defects on wafers by effectively reconditioning the planarization pad, enhancing the efficiency and reliability of the CMP process.
Implementation Method 1
A pressurized fluid material is dispensed onto the planarization pad to maintain its roughness and remove residues
Implementation Method 2
using a pad conditioner with a rotatable plate and nozzle openings to ensure efficient reconditioning
Data Source
AI summary
A method including rotating a plate of a pad conditioner about an axis parallel to an axis of rotation of a planarization pad of a planarization device. The method further includes dispensing a fluid material onto an upper surface of the planarization pad through a nozzle opening of the pad conditioner during a planarization process, wherein the fluid material comprises an acid. The method further includes maintaining the pad conditioner at a position spaced from the upper surface of the planarization pad during the dispensing of the fluid material and the rotating of the plate.