Process Fluid Path Switching for Uniform Multi-Chamber Deposition
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Solution Overview
Problem
In semiconductor processing, achieving uniform film deposition and etching across multiple processing chambers is challenging due to tolerance mismatches and clogged process fluid lines, leading to defects and decreased yield.
Innovation Solution
A computing device controls fluid flow by translating time values into recipe parameters to manage the duration of process fluid delivery to each processing chamber, diverting excess fluid to a foreline when not needed, thereby optimizing fluid distribution and reducing clogging without duplicating the fluid delivery system for each chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If process fluid is continuously delivered to multiple processing chambers, then film deposition uniformity is improved, but fluid line clogging increases and yield decreases
Solution Approach 1:
The patent implements periodic purging cycles where process fluid is alternately directed to processing chambers and diverted to a common foreline. This periodic switching prevents continuous flow-related clogging while maintaining deposition uniformity during active processing intervals. The controller systematically cycles through chambers, directing fluid flow in periodic bursts rather than continuous streams.
Solution Approach 2:
The patent discards process fluid by diverting it to a common foreline during purging operations rather than continuing to deliver it to chambers. This controlled discarding prevents clogging by removing contaminated or excess fluid from the delivery system. The foreline acts as a collection point for discarded fluid that would otherwise cause line blockages.
2Manufacturing precision
If separate fluid delivery systems are provided for each processing chamber, then fluid flow control precision is improved, but system complexity and cost increase
Solution Approach 1:
The patent implements a universal fluid delivery system where a single process fluid source and common foreline serve multiple processing chambers. The fluid distribution system is multi-functional, capable of directing fluid to any chamber or diverting to the common foreline based on processing needs. This eliminates the need for separate dedicated delivery systems for each chamber while maintaining precise control through a centralized controller.
Solution Approach 2:
The patent introduces a common foreline as an intermediary component that mediates between the process fluid source and multiple processing chambers. This intermediary allows centralized control of fluid distribution, enabling the system to route fluid to specific chambers or divert to the foreline without requiring separate delivery systems. The foreline acts as a hub that simplifies the overall system architecture.
3Manufacturing precision
If process fluid delivery time is extended to ensure complete processing, then film thickness uniformity is improved, but processing efficiency and productivity decrease
Solution Approach 1:
The patent uses periodic switching between chamber processing and foreline purging to optimize both film uniformity and processing efficiency. During active deposition intervals, fluid is delivered to chambers for the required duration to ensure uniform film thickness. The periodic purging intervals are brief and occur between processing cycles, minimizing their impact on overall productivity while preventing clogging.
Solution Approach 2:
The patent performs preliminary purging actions before switching between chambers or operations. By diverting fluid to the common foreline in advance of potential clogging issues, the system prevents interruptions during actual processing. This preliminary diversion ensures that when fluid is delivered to chambers for film deposition, the lines are clean and flow is optimized, maintaining both uniformity and efficiency.
Data Source
AI summary
A method includes identifying time values for a length of time to carry out process fluid delivery within multiple processing chambers that concurrently process multiple substrates; translating each time value to a recipe parameter for execution of an operation of a processing recipe; and causing the operation to be performed using each recipe parameter as a control value to control valves of a fluid panel of the multiple processing chambers. For each processing chamber of the multiple processing chambers: causing the process fluid to flow to the processing chamber for a first period of time corresponding to a first time value; and causing the process fluid to flow to a divert foreline of the processing chamber for a second period of time, the second period of time being based on a timestep of the operation and the time value.