Motor Vehicle Fluid Pump Circuit Board Thermal Isolation
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Solution Overview
Problem
Existing electronic motor vehicle fluid pumps with electronically commutated drive motors face issues with heat generation from power semiconductors interfering with signal processing electronics and inducing strong interference, lacking effective electrical and thermal isolation between components.
Innovation Solution
A compact electronic engine control system with a first and second main circuit board, separated by an intermediate board connected via flexible cable strips, ensuring physical, thermal, and electrical separation of power and signal processing components, and incorporating signal decoupling electronics to prevent interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power semiconductors are used for direct control of motor coils, then motor control performance is improved, but heat generation increases and interferes with signal processing electronics
Solution Approach 1:
The circuit board is divided into two separate mainboards: a power mainboard containing power semiconductors and a signal mainboard containing signal processing electronics. This segmentation physically separates the heat-generating power components from the temperature-sensitive signal components, resolving the thermal interference problem while maintaining high motor control performance.
Solution Approach 2:
A flexible intermediate conductor strip is introduced as a mediator between the power mainboard and signal mainboard. This intermediate connector provides both mechanical connection and electrical connection while minimizing thermal coupling, allowing the system to achieve both high power control capability and thermal isolation.
2Productivity
If power semiconductors are placed close to motor coils for direct control, then control efficiency is improved, but electromagnetic interference with signal processing components increases
Solution Approach 1:
The system is segmented into two functionally independent mainboards: power mainboard for high-current power switching and signal mainboard for low-voltage signal processing. This segmentation maintains control efficiency by keeping power semiconductors close to motor coils on the power mainboard, while simultaneously reducing electromagnetic interference by physically separating signal processing components onto a different board.
Solution Approach 2:
Signal processing electronics are extracted from the power mainboard and placed on a separate signal mainboard. This extraction removes the vulnerable signal processing components from the high-interference environment near the power semiconductors and motor coils, eliminating electromagnetic interference while preserving control efficiency through the intermediate conductor strip connection.
3Temperature
If electronic components are separated onto different boards, then thermal and electrical isolation is improved, but structural complexity increases
Solution Approach 1:
The power mainboard and signal mainboard are merged into a single integrated circuit board assembly connected by a flexible intermediate conductor strip. This merging approach achieves thermal and electrical isolation between power and signal components while avoiding the complexity of completely separate boards, as the flexible connector allows for compact integration within the motor housing.
Solution Approach 2:
A flexible intermediate conductor strip is used to connect the two mainboards. This flexible film-like connector provides both mechanical support and electrical connection while being thin and adaptable, minimizing the space required and simplifying the overall structure compared to rigid separate board mounting arrangements.
Data Source
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AI summary
The invention relates to an electronic fluid pump (10) for a motor vehicle, said pump comprising an electronically commutated drive motor (20) having an electronic engine management system (30). The electronic engine management system (30) has a first main board (40) and second main board (50). In addition, the engine management system (30) has at least one intermediate board (801-802) located between the two main boards (40, 50) and electrically connected to the two main boards (40, 50) by means of a respective flexible conductor strip (701-704). At least one electronic component (681-682) is located on the intermediate boards (801-802). The two main boards (40, 50) and the intermediate boards (801-802) are located on different respective planes.