Fluid Routing Device for Integrated Circuit Die Cooling
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Solution Overview
Problem
Conventional cooling techniques, such as heat sinks and air/liquid cooling, are inadequate for high-power integrated circuit (IC) packages, leading to inefficient heat dissipation and localized hot spots, which can impair the performance and reliability of IC dies, especially in systems with increased logic and memory bandwidth demands.
Innovation Solution
A fluid routing device is mounted on the surface of IC dies within the package, utilizing channels to circulate coolant that absorbs heat, with adjustable flow rates and channel geometries to effectively cool memory IC dies and main IC dies, preventing bandwidth reduction due to temperature increases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional cooling techniques (heat sinks and forced air) are used, then the structure is simple and easy to implement, but cooling efficiency is insufficient and localized hot spots occur
Solution Approach 1:
The patent applies hydraulic cooling by circulating liquid coolant through channels formed directly in the IC die. This replaces conventional air-based cooling with liquid coolant circulation, enabling more efficient heat removal from high-power density regions and preventing localized hot spots while maintaining manufacturing feasibility through integrated channel formation
Solution Approach 2:
The patent transitions from surface-level cooling (heat sinks on the backside) to internal volumetric cooling by forming three-dimensional channels within the IC die substrate. This allows coolant to access and cool internal heat-generating regions directly, dramatically improving cooling efficiency without increasing external structural complexity
2Power
If higher power density is packed into IC dies, then processing power increases, but heat generation increases creating localized hot spots that reduce reliability
Solution Approach 1:
The patent implements localized cooling channels positioned at specific high-power density regions within the IC die. Rather than uniform cooling throughout, the channel network is strategically designed to target areas with highest heat generation, providing locally optimized thermal management that maintains performance reliability without over-cooling low-power regions
Solution Approach 2:
The use of liquid coolant circulation through internal channels provides superior heat transfer capability compared to air cooling, enabling the system to handle higher power densities by efficiently removing heat from critical regions before it can create damaging hot spots
3Temperature
If coolant flow rate is increased to improve cooling, then temperature control improves, but energy consumption increases
Solution Approach 1:
The patent employs dynamic flow rate adjustment where the coolant flow velocity is varied based on real-time thermal conditions and workload demands. During high-power operation, flow rate increases to maintain temperature control; during low-power operation, flow rate decreases to minimize energy consumption, creating an adaptive thermal management system
Solution Approach 2:
The system dynamically changes the flow rate parameter of the coolant based on operational conditions. By adjusting this key parameter rather than maintaining constant high flow, the system achieves effective temperature control during critical periods while reducing energy consumption during normal operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances cooling efficiency, maintaining high bandwidth and performance by directly contacting coolant with IC dies and adjusting flow rates to manage temperature-dependent refresh rates, thereby preventing performance degradation in high-end FPGA and memory IC systems.
Implementation Method 1
Fluid coolant is provided from a fluid inlet of a fluid routing device through channels in the fluid routing device to absorb heat generated by first and second integrated circuit dies
Implementation Method 2
The fluid coolant is provided from the channels to a fluid outlet of the fluid routing device. A flow of the fluid coolant through the fluid routing device is adjusted to reduce a temperature of the first integrated circuit die
Data Source
AI summary
A method is provided for removing heat from an integrated circuit package. Fluid coolant is provided from a fluid inlet of a fluid routing device through channels in the fluid routing device to absorb heat generated by first and second integrated circuit dies in the integrated circuit package. The fluid routing device is mounted on a surface of each of the first and second integrated circuit dies. The fluid coolant is provided from the channels to a fluid outlet of the fluid routing device. A flow of the fluid coolant through the fluid routing device is adjusted to reduce a temperature of the first integrated circuit die in response to an increase in a workload of the first integrated circuit die.