Fluid Routing Device for IC Cooling via Direct Heat Spreader Contact
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Solution Overview
Problem
Conventional cooling techniques for integrated circuit packages are inadequate in managing heat generated by high-power devices, leading to inefficient cooling and the formation of hot spots due to reliance on heat sinks and thermal interface materials that increase thermal resistance.
Innovation Solution
A fluid routing device that directly contacts a heat spreader without thermal interface material, featuring vertical and horizontal channels to efficiently distribute coolant and enhance heat transfer by ensuring uniform coolant distribution and reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cooling techniques using heat sinks and thermal interface materials are used, then the cooling system is simple to implement, but thermal resistance increases and cooling efficiency decreases
Solution Approach 1:
The patent removes thermal interface materials from the cooling system, allowing the coolant to directly contact the heat spreader. This extraction of the intermediate thermal interface layer eliminates the additional thermal resistance it introduces, directly improving cooling efficiency without requiring a fundamentally new system architecture.
Solution Approach 2:
The patent integrates the coolant delivery system directly with the heat spreader by forming channels within the heat spreader itself. This merging of the coolant pathway and heat dissipation structure eliminates the need for separate thermal interface materials and reduces thermal resistance while maintaining system simplicity.
2Reliability
If thermal interface materials are used between coolant and heat spreader, then the system is easier to manufacture, but thermal resistance increases
Solution Approach 1:
The cooling channels are formed directly within the heat spreader structure through machining or other manufacturing processes. This integration eliminates the need for separate thermal interface materials and reduces assembly steps, as the coolant flows directly through channels in the heat spreader itself, improving both heat transfer efficiency and manufacturing simplicity.
3Temperature
If heat sinks are used on IC dies, then the cooling system is simpler, but localized hot spots form due to insufficient cooling
Solution Approach 1:
The patent implements cooling channels that are in direct contact with the heat spreader, allowing coolant to flow immediately over the heated surfaces. This localized direct-contact cooling approach targets hot spots effectively, preventing temperature buildup in specific areas without requiring a completely redesigned cooling system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a more efficient and uniform heat transfer mechanism, reducing thermal resistance and improving cooling efficiency by eliminating the need for thermal interface materials and ensuring direct contact between coolant and heat spreader.
Implementation Method 1
fluid coolant in the horizontal channel directly contacts heat spreader 110 to receive heat from heat spreader 110
Implementation Method 2
fluid routing device 102 provides a more efficient and uniform means of heat transfer away from IC package 100
Data Source
AI summary
A fluid routing device includes a fluid inlet, first vertical channels, a horizontal channel, a second vertical channel, and a fluid outlet. The first vertical channels are open to the fluid inlet. The horizontal channel is open to each of the first vertical channels. The first vertical channels are oriented to provide fluid coolant from the fluid inlet vertically down to the horizontal channel. The horizontal channel is open on one side such that fluid coolant in the horizontal channel directly contacts an apparatus attached to a bottom of the fluid routing device. The second vertical channel is open to the horizontal channel. The second vertical channel is oriented to provide fluid coolant vertically up away from the horizontal channel. The fluid outlet is open to the second vertical channel such that fluid coolant from the second vertical channel exits the fluid routing device through the fluid outlet.