Fluid Spacer IC Package Assembly for Uniform Pin Load
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Solution Overview
Problem
The increasing demand for higher input/output speeds and throughput in computing systems leads to the need for higher pin density connectors, which results in non-uniform stack load distribution, warpage, and increased risk of fretting and oxidation, causing reliability issues and manufacturing complexities.
Innovation Solution
The use of fluid-filled structures, such as fluid spacers and bladders, between the backplate and the printed circuit board to distribute the stack load uniformly across the pins, reducing the force required for pin loading and minimizing warpage and fretting damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If higher pin density connectors are used to increase computing power and throughput, then input/output speed and data transfer capability are improved, but non-uniform stack load distribution and warpage occur
Solution Approach 1:
A fluid spacer is introduced as an intermediary component between the socket and the circuit board. This fluid spacer distributes the stack load uniformly across the pins by utilizing fluid pressure transmission, thereby resolving the non-uniform load distribution problem while maintaining high pin density for improved I/O speed
Solution Approach 2:
The patent employs hydraulic principles by using a fluid-filled spacer to transmit and distribute mechanical load. The incompressible nature of the fluid ensures uniform pressure distribution across all pins, preventing warpage and maintaining stable stack load distribution even with high pin density configurations
2Reliability
If higher compression forces are applied to increase pin load for reliable connection, then connection reliability is improved, but component warpage and fretting damage increase
Solution Approach 1:
The fluid spacer acts as a mediator that distributes compression forces uniformly across all pins. This eliminates stress concentration at specific locations, preventing both warpage and fretting damage while maintaining the necessary pin load for reliable electrical connections
Solution Approach 2:
The patent changes the physical state of the loading mechanism from rigid to fluid-based. The fluid spacer allows dynamic adaptation of pressure distribution, maintaining optimal pin load parameters throughout the connection interface without causing harmful stress concentrations that lead to warpage and fretting
3Stability of the object's composition
If larger backplate thickness is used to reduce warpage, then structural stability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The fluid spacer serves as a compensating intermediary that provides structural stability through uniform pressure distribution. This allows the use of thinner backplates since the fluid spacer compensates for potential warpage, thereby reducing manufacturing complexity and cost while maintaining structural stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution achieves a more even pin load distribution, reduces component warpage, and minimizes fretting damage by absorbing vibrations, thereby enhancing the reliability and longevity of the electrical connections while allowing for smaller backplate thickness and reduced manufacturing costs.
Implementation Method 1
fluid-filled structures, such as fluid spacers and bladders, between the backplate and the printed circuit board to distribute the stack load uniformly across the pins
Data Source
AI summary
Integrated circuit packages with fluid spacers to improve pin load distribution are disclosed. An example apparatus includes an integrated circuit (IC) package, a circuit board, a socket to couple the IC package and the circuit board, a backplate coupled to the circuit board, a loading assembly to provide a stack load to the IC package, and a fluid liner positioned between the circuit board and the backplate.