Integrated Fluid Temperature Control for Compact Precision Heating

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Solution Overview

Problem

Conventional fluid temperature control devices for semiconductor manufacturing processes are inefficient in quickly and precisely adjusting the temperature of processing liquids due to the separate and large-sized configurations of thermoelectric modules and heaters, leading to increased system size and reduced precision.

Innovation Solution

A compact fluid temperature control device design featuring heat transfer plates with integrated heaters and thermoelectric modules, where the heaters are disposed within the plates and thermoelectric modules are on the outer surfaces, connected via an insulating layer, allowing for efficient heat transfer and precise temperature control.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If thermoelectric modules and heaters are independently disposed and mutually connected through pipe, then heating and cooling functions are provided, but the device size increases and temperature adjustment speed decreases

Engineering Contradiction:

Improveheating and cooling functionVSAvoiddevice size

Core Design Contradiction:

Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The patent combines the thermoelectric module and heater into a single integrated assembly where the heater is positioned adjacent to the thermoelectric module within the same housing structure. This merging eliminates the need for separate pipe connections and reduces overall device volume while maintaining both heating and cooling capabilities.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The heater is nested within the housing structure alongside the thermoelectric module, with both components sharing the same spatial envelope. The heater can be positioned within the housing to utilize unused space, creating a compact nested arrangement that reduces device size without compromising functionality.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Adaptability or versatility

If thermoelectric modules and heaters are independently disposed and mutually connected through pipe, then heating and cooling functions are provided, but temperature adjustment precision decreases

Engineering Contradiction:

Improveheating and cooling functionVSAvoidtemperature adjustment precision

Core Design Contradiction:

Adaptability or versatilityVSMeasurement precision

Solution Approach 1:

The integrated assembly positions the heater and thermoelectric module in close proximity within the same housing, enabling rapid thermal response and precise temperature control. The merged structure allows for better thermal coupling and faster temperature adjustment compared to separate pipe-connected components.

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If heater heating capability is set higher than thermoelectric module heating capability, then temperature control range is improved, but thermoelectric module junction temperature increases

Engineering Contradiction:

Improvetemperature control rangeVSAvoidthermoelectric module life

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent introduces a heat dissipation structure or thermal management system as an intermediary between the heater and thermoelectric module. This intermediary component helps regulate the thermal environment, allowing the heater to provide high heating capability while the thermoelectric module operates within safe temperature limits through effective heat dissipation pathways.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables rapid and precise temperature adjustments of the processing liquid, reducing the overall size of the device and extending the life of thermoelectric modules by maintaining lower junction temperatures.

Implementation Method 1

heaters which heat the temperature-controlled fluid flowing through the flow passages via at least one of the heat transfer plates

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

thermoelectric modules which heat and cool the temperature-controlled fluid flowing through the flow passages via at least one of the heat transfer plates

Methodology Applied

Scientific EffectThermoelectric effect: Peltier Effect

Implementation Method 3

a water jacket thermally connected to the thermoelectric modules via the insulating layer

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS8109328B2Fluid temperature control device

Publication Date: 2012.02.07 KELK LTD

AI summary

A fluid temperature control device, which is particularly suitably applied to the temperature control of a processing liquid in a semiconductor device manufacturing process, capable of performing quickly and precisely the temperature control of a temperature-controlled fluid, and the device can also be made as small as possible. This fluid temperature control device includes a body block having flow passage grooves formed therein; heat transfer plates which are disposed on surfaces of the body block to form flow passages where a temperature-controlled fluid flows; heaters which heat the temperature-controlled fluid flowing through the flow passages via at least one of the heat transfer plates; and thermoelectric modules which heat and cool the temperature-controlled fluid flowing through the flow passages via at least one of the heat transfer plates.