Fluid Transfer of Packaged Semiconductor Elements for Uniform Placement
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Solution Overview
Problem
Existing massive transfer techniques for electronic elements on substrates suffer from non-uniform distribution, leading to performance variations across regions and increased production costs due to incomplete transfers.
Innovation Solution
A manufacturing method involving packaging semiconductor elements with filling material layers and transferring them to substr with recesses using fluid transfer, ensuring uniform distribution and complete transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If stamp transfer is used to transfer electronic components, then the transfer process can be completed, but the distribution of electronic elements on the target substrate becomes non-uniform, leading to performance variations across regions
Solution Approach 1:
The patent applies fluid pressure to control the transfer of semiconductor elements. By regulating the pressure of the fluid medium, elements are uniformly pushed from the source substrate to the target substrate, ensuring even distribution across the substrate surface and eliminating the non-uniformity problems associated with stamp transfer methods.
Solution Approach 2:
The patent changes the physical state and parameters of the transfer medium from solid (stamp) to fluid. By controlling fluid pressure, flow rate, and other parameters, the transfer process achieves uniform distribution of semiconductor elements, resolving the performance consistency issue caused by stamp transfer.
2Productivity
If stamp transfer is used to transfer electronic components, then the transfer can be performed, but incomplete transfer occurs, increasing production cost
Solution Approach 1:
The fluid pressure system ensures complete transfer of semiconductor elements by applying uniform pressure across the entire source substrate surface. This hydraulic/pneumatic approach prevents elements from being left behind, achieving near 100% transfer completeness and eliminating the waste associated with incomplete stamp transfers.
Solution Approach 2:
The patent implements a continuous transfer process where fluid pressure continuously acts on the semiconductor elements, ensuring uninterrupted and complete transfer from source to target substrate. This continuous action eliminates the intermittent nature of stamp transfer that leads to incomplete transfers and element waste.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the uniformity of electronic element performance on substrates and reduces production costs by minimizing waste and improving transfer efficiency.
Implementation Method 1
disposing the plurality of packaged semiconductor elements in the at least one first recess of each of the plurality of working areas through fluid transfer
Data Source
AI summary
A manufacturing method of an electronic device is disclosed by the present disclosure. The manufacturing method includes providing a plurality of semiconductor elements; performing a packaging process on the plurality of semiconductor elements to form a plurality of packaged semiconductor elements, wherein the packaging process includes disposing a plurality of filling material layers respectively on a sidewall of each of the plurality of semiconductor elements; providing a substrate, wherein the substrate includes a plurality of working areas, and each of the plurality of working areas includes at least one first recess; and disposing the plurality of packaged semiconductor elements in the at least one first recess of each of the plurality of working areas through fluid transfer.