Fluidic Baffle Structure for Uniform Supercritical Substrate Drying
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Solution Overview
Problem
High-pressure supercritical fluid distribution in substrate processing leads to pattern collapse due to insufficient fluid density and inertial forces on the substrate, causing defects during the drying process.
Innovation Solution
A fluidic baffle with a three-dimensional curved structure and triperiodic minimum curved surface is integrated into the substrate processing apparatus, featuring unit cells with oblique passages that dissipate surge pressure, reducing the inertial force exerted on the substrate by distributing the fluid evenly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high pressure supercritical fluid is supplied at high speed from a small diameter fluid supply port, then the drying speed is improved, but the fluid density becomes insufficient and inertial forces cause pattern collapse
Solution Approach 1:
The fluid supply system is segmented into multiple fluid supply ports instead of a single port. This segmentation allows the high pressure supercritical fluid to be distributed through multiple smaller openings, reducing the inertial force and fluid density issues while maintaining high drying speed. The plurality of fluid supply ports disperses the fluid flow to prevent pattern collapse on the substrate.
Solution Approach 2:
The invention introduces a new spatial dimension by arranging fluid supply ports in a two-dimensional array pattern on the substrate surface. This dimensional change allows uniform distribution of supercritical fluid across the entire substrate area, ensuring consistent drying speed and density without causing localized inertial forces that would lead to pattern collapse.
2Productivity
If high pressure supercritical fluid is supplied to dry the substrate, then the drying efficiency is improved, but the fluid density is not sufficiently high causing defects
Solution Approach 1:
The invention applies local quality by making the fluid supply characteristics location-dependent across the substrate surface. Each region receives supercritical fluid through optimally positioned supply ports, ensuring that the fluid density and flow rate are appropriately adjusted for local requirements. This localized control maintains sufficient fluid density throughout the drying process while preserving high drying efficiency.
Solution Approach 2:
The invention changes the parameters of fluid supply by adjusting the number, size, and distribution of fluid supply ports. These parameter modifications optimize the fluid density and flow characteristics to ensure sufficient density for reliable drying while maintaining high drying efficiency. The parameter changes transform the fluid supply system to prevent defects caused by insufficient density.
3Device complexity
If a single fluid supply port is used, then the device complexity is reduced, but the fluid distribution becomes uneven causing inertial forces on the substrate
Solution Approach 1:
The single fluid supply port is segmented into multiple fluid supply ports arranged in a two-dimensional array. This segmentation improves fluid distribution uniformity across the substrate by eliminating localized inertial forces. Although the number of ports increases device complexity, the segmentation is essential to achieve stable and uniform fluid distribution that prevents substrate damage.
Solution Approach 2:
The invention introduces intermediary structures (multiple fluid supply ports and support members) that mediate between the supercritical fluid source and the substrate. These intermediaries distribute the fluid uniformly and reduce inertial forces, ensuring stable fluid distribution. The support members act as intermediaries to hold the substrate at an optimal distance, further stabilizing the fluid distribution process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The fluidic baffle effectively relieves the flow rate and pressure of the supercritical fluid, preventing pattern collapse and ensuring reliable substrate drying by reducing inertial forces during the semiconductor photo process.
Implementation Method 1
Each of the upper baffle and the lower baffle has a three-dimensional curved structure where an interior is divided into two subspaces twisted with each other by an interface and having triperiodic minimum curved surface (TPMS)
Implementation Method 2
unit cells with oblique passages that dissipate surge pressure, reducing the inertial force exerted on the substrate by distributing the fluid evenly
Implementation Method 3
a recess provided in an upper wall of the chamber and having a diffuser shape whose diameter gradually increases from an outlet of the upper supply port
Data Source
AI summary
A substrate processing apparatus includes a chamber configure to provide a space for processing a substrate, a substrate support configured to support the substrate in the chamber, an upper supply port provided in an upper portion of the chamber and configured to supply a supercritical fluid on an upper surface of the substrate, a recess provided in an upper wall of the chamber and having a diffuser shape whose diameter gradually increases from an outlet of the upper supply port, and a fluidic baffle disposed in the recess between the upper supply port and the substrate and including unit cells repeatedly arranged in a space with same phases and geometric sizes and in fluid communication with each other.