Fluidic Channel Electrical Connections via Substrate Routing
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Solution Overview
Problem
Existing methods for establishing electrical connections between MEMS/NEMS structures within fluidic channels face challenges such as introducing disturbances in fluid circulation, generating dead volumes, and being unsuitable for sensitive structures requiring semiconductor or small metal contact pads, especially in high-density networks.
Innovation Solution
A device with a fluidic channel structure featuring a substrate with surface-mounted electrical connections covered by an intermediate layer, which allows for leaktight sealing without the need for vias through the cover or large cavities, enabling simplified production and minimizing disruption to fluid flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If Via-type connections (TSV/TGV) are made through the cover to establish electrical connections, then electrical continuity is ensured, but the fluidic channel operation is disturbed and the manufacture of small contacts becomes difficult
Solution Approach 1:
The device is segmented into distinct functional zones: the fluidic channel cavity and the electrical connection zone. Contact pads are positioned outside the fluidic channel on the substrate, and connection lines route electrical signals through the substrate thickness without penetrating the fluidic channel cavity. This spatial segmentation eliminates fluid circulation disturbances while maintaining electrical connectivity.
Solution Approach 2:
The substrate acts as an intermediary element that provides both mechanical support and electrical conduction pathways. Instead of using TSVs that penetrate the cover and disturb the fluid channel, the substrate serves as a mediating structure with integrated connection lines that route signals from the MEMS/NEMS structure to external contacts without interfering with the fluidic environment.
2Ease of operation
If large cavities are opened in the cover above metallized pads for wirebonding, then electrical connections are reestablished, but additional patterns are introduced that disturb fluid circulation and create dead volumes
Solution Approach 1:
The contact pads are segmented and positioned in a separate zone outside the fluidic channel on the substrate. This eliminates the need to open large cavities in the cover, as the electrical connection points are already accessible on the substrate surface. The fluidic channel maintains its intact geometry without additional patterns or dead volumes.
Solution Approach 2:
The electrical connection architecture transitions from a vertical through-cover approach to a lateral routing approach on the substrate plane. Connection lines extend laterally on the substrate to reach contact pads positioned outside the fluidic channel, eliminating the need for vertical cavity openings that would create dead volumes in the fluid path.
3Measurement precision
If contact pads are made of semiconductor material or small metal to reduce parasitic capacitances, then signal-to-noise ratio is improved, but the connection technique must be compatible with high-density NEMS/MEMS networks
Solution Approach 1:
The substrate serves multiple functions: it provides mechanical support for the NEMS/MEMS structures, acts as a platform for forming semiconductor or metal contact pads with minimal parasitic capacitance, and integrates connection lines for electrical signaling. This universal substrate approach accommodates high-density networks while maintaining signal integrity.
Solution Approach 2:
The electrical connection structure merges the contact pads and connection lines into a unified integration layer on the substrate. This combined approach allows small metal or semiconductor contact pads to be formed directly on the substrate near the NEMS/MEMS structures, reducing parasitic capacitances while maintaining compatibility with high-density interconnections through standardized fabrication processes.
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 2B'~2C
AI summary
Device comprising a substrate including at least one microelectronic and/or nanoelectronic structure (NEMS) having a sensitive part and a fluidic channel (2), the fluidic channel (2) having two lateral walls (6.1), an upper wall (6.2) connecting the two lateral walls (6.1), a lower wall formed by the substrate, and at least two openings to ensure circulation in the fluidic channel (2), the openings being defined between the two lateral walls (6.1), the structure being located inside the fluidic channel, electrical connection lines (8) extending between the structure and the outside of the fluidic channel (6), the connection lines (8) being made on the substrate (4) and passing under the lateral walls (6.1), the device also comprising an intermediate layer (20) having a flat face in contact with base faces of said lateral walls (6.1), the connecting lines (8) being at least partially covered by said intermediate layer (20) at least vertically below the base faces of the side walls (6.1), the side walls (6.1) being sealed watertight to the substrate (4) by sealing to the intermediate layer (20).