Fluidic-Channel Cooled Power Modules Without Thermal Interface Layers

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Solution Overview

Problem

Existing semiconductor device modules face challenges in achieving desired thermal resistance while minimizing package size and material costs, as traditional thermal dissipation methods, such as fin pin cooling plates or heat sinks, are size-limited and hindered by thermal interface materials.

Innovation Solution

Incorporating a cooling structure with fluidic-cooling channels directly coupled to a ceramic substrate within a molding compound, eliminating the need for thermal interface materials and allowing for dual- or single-sided cooling configurations, which reduces thermal resistance by up to 25% compared to conventional cooling plates or heat sinks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional thermal dissipation methods (fin pin cooling plates or heat sinks) are used, then thermal resistance can be reduced, but package size increases and material costs increase

Engineering Contradiction:

Improvethermal resistanceVSAvoidpackage size

Core Design Contradiction:

TemperatureVSVolume of stationary object

Solution Approach 1:

The cooling structure is merged with the molding compound to form an integrated assembly. The molding compound encapsulates the ceramic substrate and bonding pads while incorporating the cooling structure directly within it, eliminating the need for separate cooling plates or heat sinks. This integration reduces package size while maintaining thermal performance.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The cooling structure utilizes fluidic channels formed within the molding compound to circulate coolant for thermal management. These channels are created using mold cavities during the molding process, allowing efficient heat dissipation through fluid flow without requiring additional external cooling components.

Inventive Principle:

Principle #29Pneumatics and hydraulics

2Temperature

If traditional thermal dissipation methods (fin pin cooling plates or heat sinks) are used, then thermal resistance can be reduced, but material costs increase

Engineering Contradiction:

Improvethermal resistanceVSAvoidmaterial costs

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The cooling structure and molding compound are combined into a single integrated component manufactured in one process step. This eliminates the need for separate cooling plates, thermal interface materials, and multiple assembly steps, thereby reducing material costs and simplifying manufacturing.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The cooling structure is formed directly within the molding compound using mold cavity parameters, changing the manufacturing approach from assembling separate thermal management components to integrating cooling functionality into the molding process itself. This reduces both material and manufacturing complexity costs.

Inventive Principle:

Principle #35Parameter changes

3Temperature

If thermal interface materials (such as thermal grease) are used, then thermal dissipation can be achieved, but thermal dissipation efficiency decreases

Engineering Contradiction:

Improvethermal dissipation efficiencyVSAvoidthermal dissipation efficiency

Core Design Contradiction:

TemperatureVSLoss of energy

Solution Approach 1:

Thermal interface materials such as thermal grease are completely eliminated from the design. The cooling structure is formed directly within the molding compound, creating direct thermal contact pathways from the ceramic substrate to the coolant channels without requiring intermediary thermal interface materials that impede heat transfer efficiency.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The molding compound serves as a composite material that simultaneously provides structural encapsulation and thermal management functionality. By integrating the cooling structure directly into the molding compound matrix, the system achieves efficient thermal dissipation without the thermal resistance introduced by separate thermal interface materials.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables a reduction in package size while maintaining or improving thermal performance, enhancing the reliability and efficiency of semiconductor device modules by integrating fluidic-channel cooled substrates with coolant distributors for effective thermal management.

Implementation Method 1

a cooling structure disposed on the second surface of the ceramic substrate, wherein the cooling structure includes a plurality of fluidic-cooling channels

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 2

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS20240186218A1Molded power modules with fluidic-channel cooled substrates

Publication Date: 2024.06.06 SEMICON COMPONENTS IND LLC

AI summary

In a general aspect, a semiconductor device module includes a ceramic substrate having a first surface and a second surface opposite the first surface. A patterned metal layer is disposed on the first surface of the ceramic substrate, and a semiconductor die is disposed on the patterned metal layer. A cooling structure is disposed on the second surface of the ceramic substrate, where the cooling structure includes a plurality of fluidic-cooling channels. The module also includes a molding compound that encapsulates the ceramic substrate, the patterned metal layer and the semiconductor die, and partially encapsulates the cooling structure, such that a fluidic interface surface of the cooling structure is exposed through the molding compound.