Fluidic Elastomer Circuits for Lightweight VR Haptic Gloves
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Solution Overview
Problem
Conventional wearable devices for virtual reality (VR) systems are hindered by complex, bulky, and heavy circuitry, which limits their compactness, reliability, and scalability, affecting user experience due to thermal dissipation, power distribution, and energy storage constraints.
Innovation Solution
A large-scale integration (LSI) device is developed, combining fluidic and non-fluidic circuits using polymer and fabric materials, with specific design rules and manufacturing processes to create a compact, efficient, and scalable haptic glove system, incorporating fluidic actuators and sensors for enhanced VR experiences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional circuitry is used in wearable devices, then sensing and actuation functions can be provided, but the device becomes complex, bulky, and heavy
Solution Approach 1:
The wearable device is divided into multiple flexible circuit boards, each dedicated to specific functions (sensing, actuation, control). This segmentation allows each circuit board to be optimized independently for weight and flexibility, reducing the overall device burden while maintaining full functionality.
Solution Approach 2:
The patent transitions from rigid, planar circuit boards to three-dimensional flexible circuit boards that can be conformally mounted on curved surfaces. This dimensional change allows circuits to wrap around contours, reducing the need for additional mounting hardware and structural support, thereby reducing weight.
2Reliability
If complex assemblies are implemented in wearable devices, then enhanced tactile and kinesthetic experiences are achieved, but thermal dissipation and power distribution constraints are exceeded
Solution Approach 1:
Flexible circuit boards are designed with spatially varying properties: high-conductivity trace patterns in regions requiring power distribution, thermally conductive pathways near heat-generating components, and flexible substrate materials with appropriate thermal mass. This local optimization allows enhanced functionality in specific areas without causing system-wide thermal problems.
Solution Approach 2:
The flexible circuit board incorporates thermal interface materials and heat dissipation structures that act as intermediaries between heat-generating components and the external environment. These intermediaries facilitate efficient heat transfer while maintaining the flexibility and conformability of the wearable device.
3Reliability
If conventional circuitry is used in wearable devices, then sensing and actuation can be provided, but the device becomes bulky
Solution Approach 1:
Multiple circuit functions (sensing, actuation, signal conditioning, power management) are integrated onto single flexible circuit boards. This merging eliminates the need for separate discrete components and their associated mounting structures, significantly reducing device volume while maintaining full functionality.
Solution Approach 2:
Circuits are configured to wrap around three-dimensional contours and conform to curved surfaces, utilizing the third dimension for spatial arrangement. This allows compact integration of multiple circuit elements without increasing planar footprint, reducing overall device volume.
4Productivity
If mass manufacturing is enabled through soft polymer implementation, then production scalability is improved, but manufacturing precision requirements increase
Solution Approach 1:
A single flexible circuit board design serves multiple functions: sensing, actuation, and structural support. This universality allows standardization of the circuit board platform across different wearable device variants, enabling mass production through modular assembly while maintaining precision through proven manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The LSI device achieves high force-density with low thermal dissipation, allows control of multiple devices, and enables mass manufacturing, resulting in a more compact, reliable, and scalable VR haptic system that enhances user interaction with virtual environments.
Implementation Method 1
The LSI device may include fluidic and non-fluidic circuits, and may be used as a component in a VR/AR/MR device. For example, the LSI device may be part of the control, sensing, and actuation components of a haptic glove, and may comprise layers of fluidic and non-fluidic circuits. These layers may be composed of various polymer and fabric materials, and include channels for the flow of fluid
Implementation Method 2
In one embodiment, the LSI device is formed by forming a first elastomer layer of a large scale integration (LSI) device on a substrate according to a specified manufacturing process, the first elastomer layer having a plurality of fluid based circuits
Data Source
AI summary
A method for large scale integration of haptic devices is described. The method comprises forming a first elastomer layer of a large scale integration (LSI) device on a substrate according to a specified manufacturing process, the first elastomer layer having a plurality of fluid based circuits, the first elastomer layer adhering to a plurality of formation specifications. The method further comprises curing the first elastomer layer. Additionally, one or more additional elastomer layers of the LSI device are formed with the first elastomer layer according to the specified manufacturing process, the one or more additional elastomer layers having a plurality of fluid based circuits, the one or more additional elastomer layers adhering to the plurality of formation specifications.