Fluidic MEMS Sensor Sealing Element Fabrication
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Solution Overview
Problem
The fabrication of fluidic microelectromechanical (MEM) sensor systems is complex and costly due to the need for accurate and intricate attachments of semiconductor dies to carriers, requiring expertise in semiconductor fabrication, plastic packaging, and electronic circuit board design, which complicates the integration of fluidic MEM sensors.
Innovation Solution
The development of MEMS structures with a main body structure having a fluid passage and a sealing element with integrated electrical and/or sensor components, allowing for simplified production by patterning or attaching components on the sealing element after it is attached to the main body, using thin polymeric materials and 3D object production techniques to create layers that can be easily assembled and calibrated as arrays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor dies are attached to carriers with plastic packaging elements, then electrical and mechanical connectivity is achieved, but device complexity and manufacturing cost increase significantly
Solution Approach 1:
The patent combines semiconductor die, fluidic structures, and electrical connectivity into a single integrated semiconductor device. The fluidic MEMS structures are formed directly on the semiconductor die, eliminating the need for separate plastic packaging elements and carrier attachments, thereby reducing device complexity while maintaining connectivity.
Solution Approach 2:
The semiconductor die serves multiple functions simultaneously: it provides the sensing elements, houses the fluidic flow paths, and establishes electrical connectivity. This multi-functionality eliminates the need for separate dedicated packaging and connection components, reducing overall device complexity.
2Manufacturing precision
If accurate attachment of semiconductor die to carrier is performed, then pressure force transmission and alignment are guaranteed, but manufacturing time and cost increase
Solution Approach 1:
The fluidic flow paths and sensing elements are formed directly on the semiconductor die during the semiconductor fabrication process itself, before final device assembly. This preliminary formation ensures precise alignment between fluidic structures and sensors without requiring complex post-fabrication attachment and alignment operations.
Solution Approach 2:
The patent merges the formation of fluidic structures with the semiconductor fabrication process. By using standard semiconductor manufacturing techniques to create both the electronic circuitry and fluidic MEMS structures on the same die, precise alignment is achieved inherently, eliminating time-consuming separate alignment and attachment steps.
3Adaptability or versatility
If separate packaging and electrical interface components are used, then functional requirements are met, but production cost increases
Solution Approach 1:
The patent integrates electrical contacts, fluidic ports, and sensing elements into a single semiconductor die structure. This consolidation eliminates the need for separate packaging elements, carrier boards, and external electrical interfaces, thereby reducing the number of components that need to be manufactured, inventoried, and assembled, which directly reduces production cost.
Solution Approach 2:
The semiconductor die is designed to perform multiple functions: sensing, fluidic transport, and electrical connection. This universal design approach eliminates the need for specialized separate components for each function, reducing overall bill of materials cost and simplifying the manufacturing supply chain.
Data Source
AI summary
Structure and assembly of fluidic sensor devices are disclosed. A fluid sensor in some possible embodiments comprises a unitary/monolithic base body structure, or a base body structure assembled from two or more separate body elements configured to attach one to the other, and the base body structure having a fluid channel passing along the base body structure, an opening formed in said base body structure and fluidly communicating with the channel, and a sealing element comprising one or more sensing elements patterned thereon and sealably attached over the at least one opening such that its one or more sensing elements become located over the at least one opening.