Fluidic MEMS Test Station for Unpackaged Substrate Testing
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Solution Overview
Problem
Current methods for testing fluidic MEMS components are time-consuming and costly, particularly due to the need for manual or half-automatic testing of unpackaged chips, which can introduce errors and require retesting after packaging, limiting their scalability and economic viability.
Innovation Solution
A test station and method for automatically testing fluidic components on a substrate or wafer level, utilizing a carrier device, connecting device, and displacement device to fluidically connect and test multiple components sequentially or simultaneously, reducing the need for individual adapter setups and minimizing packaging-related errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual or half-automatic testing methods are used for fluidic MEMS components, then testing can be performed on unpackaged chips, but the process becomes time-consuming and costly due to the need for retesting after packaging
Solution Approach 1:
The patent applies preliminary action by performing testing on fluidic MEMS components before packaging. The test station establishes fluidic connections with components on the substrate in their unpackaged state, allowing defects to be identified before irreversible packaging occurs. This prevents the need for retesting after packaging, eliminating time losses and associated costs while maintaining testing reliability.
2Reliability
If chips are mounted into packages with adhesive before testing, then components are protected, but defective chips cannot be reused and additional costs are incurred
Solution Approach 1:
The patent performs testing before packaging, allowing defective chips to be identified and discarded without incurring packaging costs. By establishing fluidic connections directly with components on the substrate, the system enables defect detection prior to adhesive mounting, preventing waste of packaging materials and reducing manufacturing costs while maintaining component protection for non-defective parts.
Solution Approach 2:
The test station enables self-service testing where the fluidic MEMS components are tested in their native substrate configuration without requiring external packaging. The system directly interfaces with components through the substrate, allowing automatic identification and elimination of defective units before they undergo costly packaging processes.
3Adaptability or versatility
If individual adapter setups are used for each chip, then specific testing requirements can be met, but device complexity and costs increase
Solution Approach 1:
The patent employs a universal test station design that can interface with multiple fluidic MEMS components through a single substrate connection system. The test station uses a common fluidic connection interface that works with different component types on the substrate, eliminating the need for individual adapter setups for each chip while maintaining testing flexibility and adaptability across various component configurations.
Solution Approach 2:
The patent merges multiple testing functions into a single integrated test station that handles multiple components simultaneously or sequentially through one substrate interface. By combining what would traditionally require separate adapters into a unified system, the patent reduces device complexity while preserving the ability to meet specific testing requirements for different component types.
Data Source
AI summary
A test station for testing at least one of fluidic component arranged on a substrate, each fluidic component having a fluidic port, comprises a carrier device for holding the substrate with the at least one fluidic component, a connecting device for fluidically connecting the fluidic port of the at least one fluidic component located in a testing position to a first adapter element of the connecting device, and a displacement device configured to displace the substrate and the connecting device relative to each other, and to bring the substrate into the testing position.