Fluidic Microchannels in 3D Semiconductor Cooling
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Solution Overview
Problem
In 3D integrated semiconductor structures, heat removal becomes problematic due to increased heat generation without a proportional increase in heat-dissipating surface area, necessitating innovative cooling methods.
Innovation Solution
The formation of fluidic microchannels within semiconductor structures using laterally extending recesses in dielectric materials, allowing for direct dielectric-to-dielectric molecular bonding and efficient fluid flow for heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If 3D integration of semiconductor structures is implemented to improve electrical performance and reduce device footprint area, then device density and electrical performance are improved, but heat removal becomes problematic due to increased heat generation without proportional increase in heat-dissipating surface area
Solution Approach 1:
The patent transitions from conventional 2D surface cooling to 3D volumetric cooling by embedding fluidic microchannels within the bulk of the semiconductor substrate. This allows heat to be removed from the interior volume of the device rather than solely from the external surface, effectively adding a third dimension to the heat dissipation pathway and enabling proportional heat removal scaling with device density increases.
Solution Approach 2:
The patent introduces a fluid medium (coolant) as an intermediary between the heat-generating semiconductor devices and the heat sink. The fluidic microchannels carry this intermediary substance through the substrate, allowing efficient thermal energy transfer from the devices to the flowing fluid, which then transports heat away from the high-density device region.
2Temperature
If fluid channels with microscale dimensions are incorporated into 3D integrated semiconductor structures to enable fluid flow for heat removal, then heat dissipation capability is improved, but fabrication complexity increases
Solution Approach 1:
The patent performs preliminary actions by forming the fluidic microchannels and recesses in the substrate before the semiconductor devices are fabricated and mounted. This sequence allows the cooling infrastructure to be pre-integrated into the substrate structure, simplifying subsequent device assembly and reducing overall fabrication complexity compared to attempting to add cooling features after device fabrication.
Solution Approach 2:
The patent implements a nested structure where fluidic microchannels are embedded within the substrate, which itself contains or supports the semiconductor devices. This nested arrangement integrates multiple functions (structural support, heat conduction, fluid flow) within a hierarchical structure, maximizing heat dissipation efficiency while minimizing the overall device footprint and fabrication steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively enhances heat removal from semiconductor devices by utilizing fluidic microchannels to circulate cooling fluids, addressing the challenge of thermal management in densely integrated semiconductor systems.
Implementation Method 1
fluid to flow through the fluidic microchannels during operation of the devices in the 3D integrated semiconductor structures for removal of heat
Implementation Method 2
circulate cooling fluids, addressing the challenge of thermal management
Implementation Method 3
bonding the semiconductor material to the substrate by establishing dielectric-to-dielectric molecular bonds directly between the first dielectric material on the substrate and the second dielectric material on the semiconductor material
Data Source
AI summary
Semiconductor structures are fabricated that include a semiconductor material bonded to a substrate with a layer of dielectric material between the semiconductor material and the substrate. At least one fluidic microchannel extends in a lateral direction through the layer of dielectric material between the semiconductor material and the substrate. The at least one fluidic microchannel includes at least one laterally extending section having a transverse cross-sectional shape entirely surrounded by the layer of dielectric material.