Fluidic Wafer Probe for Dry-Pad Electrochemical Sensor Testing
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Solution Overview
Problem
Testing electrochemical sensors at the wafer level is challenging due to the need for sensor circuitry to be in contact with a fluid while bond pads must remain dry for electrical probing.
Innovation Solution
A wafer probe test system using a conductive needle and a multichannel fluid probe that forms a fluidic seal between the sensor face and conductive features on the wafer, allowing fluid flow across the sensor face while maintaining dry bond pads for electrical testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual testing methods are used to avoid fluid contamination, then bond pads remain dry, but scalability and productivity are severely limited
Solution Approach 1:
The fluid probe integrates multiple functions into a single tool: it provides fluid delivery, creates a fluidic seal, and defines a controlled fluid flow path across the sensor face area. This multi-functional probe enables automated high-volume testing while maintaining the simplicity of wafer-level processing and avoiding the need for complex assembly steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables scalable, reproducible, and cost-effective wafer-level testing of electrochemical sensors by separating the active sensor face from conductive features, facilitating stable fluid exchange and reliable electrical testing without residue or evaporation issues.
Implementation Method 1
The multichannel tube has a first channel and a second channel configured to create a flow of fluid across the sensor face on the surface of the wafer
Implementation Method 2
The fluid probe is configured to engage the surface of the wafer to form a fluidic seal between a sensor face on the surface of the wafer and the conductive feature of the wafer
Data Source
AI summary
A wafer probe test system has a conductive needle configured to contact a conductive feature on a surface of a wafer, and a fluid probe having a multichannel tube, the fluid probe configured to engage the surface of the wafer to form a fluidic seal between a sensor face on the surface of the wafer and the conductive feature of the wafer, the multichannel tube having a first channel and a second channel configured to create a flow of fluid across the sensor face on the surface of the wafer.