Fluidized Conductive Material for Inkjet Head Wiring Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electrical connection structures in inkjet recording heads are prone to failure due to heat and mechanical stress, causing peeling or breaking of connection wirings between the driving IC and the piezoelectric element.
Innovation Solution
An electrical connection substrate with a through hole filled with a fluidized conductive material, such as solder or metal paste, to reinforce the connection and maintain electrical contact between connection target members, including electrodes and circuits, even under stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection wirings are directly connected to the electrode film of the piezoelectric element by thin film through a through groove, then electrical connection is achieved, but the wiring may be peeled off or broken due to heat stress or mechanical stress
Solution Approach 1:
The patent uses a composite material structure where a metal material (such as solder) is combined with the thin film wiring to form a reinforced connection. The metal material fills the through groove and bonds with both the electrode film and the wiring, creating a composite structure that distributes mechanical and thermal stress, preventing wiring peeling or breakage while maintaining electrical connection.
2Reliability
If a through groove is formed in the top plate member to connect driving IC to piezoelectric element, then electrical connection is established, but the connection is vulnerable to stress-induced failure
Solution Approach 1:
The patent applies beforehand cushioning by pre-filling the through groove with a metal material that acts as a stress-absorbing element. This metal material is positioned in advance to cushion and distribute the heat stress and mechanical stress that will occur during operation, preventing the wiring from being directly subjected to these harmful factors and thus avoiding peeling or breakage.
Data Source
AI summary
An electrical connection substrate includes a substrate main body in which an electrical connection through port is formed, and connection target members arranged on both sides of the substrate main body, respectively. The connection target members are electrically connected to each other through the electrical connection through port, and the electrical connection through port is filled with a fluidized conductive material. The fluidized conductive material thus filled can satisfactorily keep connection of the connection target members to each other through the electrical connection through port.